Nextreme Announces New Thermoelectric Platform

Microscopic Size and High Heat Pumping Capability of the UPF
OptoCooler is Particularly Well Suited for Opto-Electronics
Applications
DURHAM, N.C.--(Business Wire)--Nextreme Thermal Solutions(TM), the leader in microscale thermal
and power management products for the electronics industry, announces
the availability of a new thermoelectric module - the Ultra-High
Packing Fraction (UPF) OptoCooler module - that addresses the latest
cooling and temperature control requirements for optoelectronics,
electronics, medical, military and aerospace applications. The new
module has been optimized for laser diode, LED and advanced sensor
products.

The UPF OptoCooler removes a maximum of 420 mW of heat at 25
degrees C ambient in an active footprint of only 0.55 mm2. As a
result, the module can pump a heat density up to 78 W/cm2. At 85
degrees C, these values increase to 610 mW and 112 W/cm2,
respectively. The module was developed in response to market demand
for microscale cooling solutions that improve the performance of
electronics without sacrificing efficiency.

With Nextreme's thin-film thermal bump technology at its core, the
OptoCooler can be integrated directly into electronic and
optoelectronic packaging to deliver more than 45 degrees C of cooling
for a wide variety of thermal management applications. For example,
the module can be embedded within laser diode packages - devices that
illuminate telecom fiber-optic cables - to control temperatures and
maintain proper operating conditions for optimal performance. In
addition, the module's ultra-fast, millisecond response time and broad
temperature range capabilities can enable improved performance of the
thermal cycling processes in a host of applications.

"The OptoCooler module is the industry's first thermoelectric
device to offer a heat pumping density in excess of 70 W/cm2, a
ten-fold increase in heat pumping capacity over conventional TEC
modules," said Dave Koester, Vice President of Engineering at
Nextreme. "This is a major breakthrough. For example, this development
enables direct cooling of a laser diode on a scale that is similar to
the diode itself. This significantly improves efficiency and offers
new, integrated packaging options that were previously unavailable."

The UPF OptoCooler module serves as Nextreme's unit building block
for all discrete products in the future. It is manufactured in high
volumes with Nextreme's Thermal Copper Pillar Bump process - a process
that is based upon an established electronic packaging approach that
scales well into large arrays. The Thermal Copper Pillar Bump process
integrates thin-film thermoelectric material into the solder bumped
interconnects that traditionally provide mechanical and electrical
functionalities in today's high performance/high density integrated
circuits. But unlike conventional solder bumps, Nextreme bumps
function as solid-state heat pumps on a microscale. The thermal
bumping process can be implemented at the system-level, package-level
or wafer-level, and also in discrete modules as demonstrated by
Nextreme's newly available OptoCooler.

OptoCooler modules are available now and can be purchased for $12
in unit volumes of 1000's. Pricing for smaller or larger volumes are
available upon request.

Nextreme will be demonstrating the OptoCooler at the Photonics
West conference, January 22-24, 2008 in booth #6328 at the San Jose
Convention Center, South Hall 1.

For more information, contact Nextreme at 3908 Patriot Dr., Suite
140, Durham, NC 27703-8031; call (919)-597-7300; e-mail
info@nextreme.com; or go to www.nextreme.com.

About Nextreme Thermal Solutions, Inc.

Nextreme designs and manufactures microscale thermal and power
management products for the semiconductor, photonics, consumer,
automotive and defense/aerospace industries. The company has embedded
cooling, temperature control and power generation capabilities into
the widely accepted copper pillar bumping process used in high-volume
electronic packaging. Nextreme's breakthrough addresses the most
challenging thermal and power management constraints in electronics
today, and delivers the only fully-scalable technology solution by
leveraging the existing, high-volume flip chip manufacturing
infrastructure. By minimizing the need for manufacturing changes and
focusing on developing a seamless design-in solution, Nextreme will
change the future of thermal and power management for the entire
electronics industry.

Nextreme is managed by an experienced start-up team and
world-renowned experts in electronic packaging, thermal management and
pillar bump technology. The company has 38 employees and is based in
Research Triangle Park, North Carolina.

Nextreme, Inc.
Karl von Gunten, 919-316-3562
kvongunten@nextreme.com
or
BtB Marketing Communications
Garth Miller, 919-872-8172
gmiller@btbmarketing.com

Copyright Business Wire 2008