Microsemi Introduces Ultra Compact Power Modules for High Performance, Cost Competitive...

Microsemi Introduces Ultra Compact Power Modules for High Performance, Cost
Competitive Applications

IRVINE, Calif., Jan. 15, 2008 (PRIME NEWSWIRE) -- Microsemi Corporation
(Nasdaq:MSCC), a leading manufacturer of high performance analog mixed signal
integrated circuits and high reliability semiconductors, has announced a new
line of 38 standard power modules in the very low profile and compact SP1
package. Main applications are in power factor correction, motor control, UPS,
power supplies, solar inverters and welding converters.

The new line's 12mm profile provides minimum parasitic inductance, while
solderable pins provide easy mounting to top-printed circuit boards. The modules
integrate a base plate which allows the use of thinner DBC substrates. The
result is excellent heat spreading and low thermal resistance, with full
electrical isolation to the heatsink.

The new compact power modules fill the size gap between SOT227 and SP3 products
by offering the equivalent of two SOT227 packages in a single SP1 device. SP3
modules integrate the equivalent of four SOT227's.

"The low mechanical profile and internal layout of the SP1 package results in
very low parasitics, allowing the end user to get outstanding performance from
ultrafast semiconductor devices," said Serge Bontemps, Power Modules Products
Development Director in Merignac, France. "With a choice of 38 modules in our
new SP1 line, there are excellent options wherever space, electrical and thermal
performance, weight and cost are a concern," he said.

The new Microsemi modules line includes phase leg, full bridge, buck and boost
configurations. Emitter/Source switches on the bottom of the full bridge modules
provide separate connections for possible use of current sensors. All the new
modules integrate a thermal sensor to monitor case temperature and provide
over-temperature protection.

The four module configurations provide a variety of transistor options: FREDFET
switches for the phase legs and full bridge modules; standard MOSFETs for buck
and boost devices, plus CoolMos(tm), NPT, and TRENCH IGBTs.

All the SP1 MOSFET and FREDFET standard modules use the latest MOS8(tm) Power
MOSFET from Microsemi's Power Products Group. Current ratings range from 11A to
70A @ Tc= 80 Deg. C for voltages in the range of 500V to 1200V for MOSFET,
FREDFET and CoolMOS modules. Current ratings range from 20A to 150A @ Tc= 80
Deg. C for voltages in the range of 600V to 1700V for NPT and TRENCH IGBT
modules.

While the SP1 line is designed as standard modules for industrial applications,
they are easily upgraded to withstand more demanding environmental conditions:

-- Aluminum Nitride substrate can replace standard alumina for
improved thermal performance
-- SiC diodes can replace FREDs for improved switching losses or
increased operating frequency
-- Aluminum Silicon Carbide (AlSiC) base plate can replace the
standard copper base plate for reduced weight and extended lifetime
against temperature cycles of wide amplitude
Samples are available immediately, with the lead time for 10K quantities at 8 to
12 weeks. Pricing in quantities of 1000 to 2500 pieces range from $13.60 to
$48.17.

Complete specifications and technical data for the entire new SP1 power modules
line are available on the Microsemi web site: www.microsemi.com.

About Microsemi Corporation

Microsemi Corporation, with corporate headquarters in Irvine, California, is a
leading designer, manufacturer and marketer of high performance analog and
mixed-signal integrated circuits and high reliability semiconductors. The
company's semiconductors manage and control or regulate power, protect against
transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit
solutions that enhance customer designs by improving performance and
reliability, battery optimization, reducing size or protecting circuits. The
principal markets the company serves include implanted medical,
defense/aerospace and satellite, notebook computers, monitors and LCD TVs,
automotive and mobile connectivity applications. More information may be
obtained by contacting the company directly or by visiting its website at
http://www.microsemi.com.

The Microsemi Corporation logo is available at
http://www.primenewswire.com/newsroom/prs/?pkgid=1233

PLEASE READ THE FOLLOWING FACTORS THAT CAN MATERIALLY AFFECT MICROSEMI'S FUTURE
RESULTS.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of
1995: Any statements set forth in the news release that are not entirely
historical and factual in nature are forward-looking statements, including
without limitation statements concerning the expectation and timing of the
completion of the acquisition of MDT, the benefits of the acquisition of MDT and
its products, Microsemi's ability to successfully integrate and leverage the
acquired company and realize synergies, the possibility of efficiency gains, and
Microsemi's ability to enter into the sensor market and expand its portfolio of
microwave semiconductors. Forward-looking statements are inherently subject to
risks and uncertainties, some of which cannot be predicted or quantified. The
potential risks and uncertainties include, but are not limited to, such factors
as changes in generally accepted accounting principles, the difficulties
regarding the making of estimates and projections, the hiring and retention of
qualified personnel in a competitive labor market, acquiring, managing and
integrating new operations, businesses or assets, uncertainty as to the future
profitability of acquired businesses, delays in the realization of any accretion
from acquisition transactions, any circumstances that adversely impact the end
markets of acquired businesses, difficulties in closing or disposing of
operations or assets, difficulties in transferring work from one plant to
another, rapidly changing technology and product obsolescence, difficulties
predicting the timing and amount of plant closure costs, the potential inability
to realize cost savings or productivity gains and to improve capacity
utilization, potential cost increases, weakness or competitive pricing
environment of the marketplace, uncertain demand for and acceptance of the
company's products, adverse circumstances in any of our end markets including
the challenging conditions in our analog / mixed-signal markets, results of
in-process or planned development or marketing and promotional campaigns,
changes in demand for products, difficulties foreseeing future demand, effects
of limited visibility of future sales, potential non-realization of expected
orders or non-realization of backlog, product returns, product liability, and
other potential unexpected business and economic conditions or adverse changes
in current or expected industry conditions, business disruptions, epidemics,
health advisories, disasters, national emergencies, wars or potential future
effects of the tragic events of September 11, 2001, variations in customer order
preferences, fluctuations in market prices of the company's common stock and
potential unavailability of additional capital on favorable terms, difficulties
in implementing company strategies, dealing with environmental or other
regulatory matters or litigation, or any matters involving litigation,
contingent liabilities or other claims, difficulties and costs imposed by law,
including under the Sarbanes-Oxley Act of 2002, difficulties in determining the
scope of, and procuring and maintaining, adequate insurance coverage,
difficulties, and costs, of protecting patents and other proprietary rights,
work stoppages, labor issues, inventory obsolescence and difficulties regarding
customer qualification of products, manufacturing facilities and processes, and
other difficulties managing consolidation or growth, including in the
maintenance of internal controls, the implementation of information systems, and
the training of personnel. In addition to these factors and any other factors
mentioned elsewhere in this news release, the reader should refer as well to the
factors, uncertainties or risks identified in the company's most recent Form
10-K filed by Microsemi with the SEC. Additional risk factors shall be
identified from time to time in Microsemi's future filings. The forward-looking
statements included in this release speak only as of the date hereof, and
Microsemi does not undertake any obligation to update these forward-looking
statements to reflect subsequent events or circumstances.

Investor Inquiries: David R. Sonksen, Microsemi Corporation, Irvine, CA (949)
221-7101.

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CONTACT: Microsemi Corporation
Financial Contact:
David R. Sonksen, Executive Vice President and CFO
(949) 221-7101
Editorial Contact:
Cliff Silver, Manager, Corporate Communications
(949) 221-7112