Mindspeed(R) Introduces Next-Generation Family of System-on-Chip Carrier Access VoIP...

Mindspeed(R) Introduces Next-Generation Family of System-on-Chip Carrier Access VoIP Processors

Comcerto(R) 300 Series Processors Enable Cost-Effective Migration
from Class-5 TDM Voice Networks to Next-Generation IP-Based Access
with Carrier-Class Performance
NEWPORT BEACH, Calif.--(Business Wire)--Mindspeed Technologies, Inc. (NASDAQ: MSPD), a leading supplier of
semiconductor solutions for network infrastructure applications, today
announced a new family of highly-integrated voice-over-IP (VoIP)
processors designed to enable the migration of copper loop voice
access networks from traditional Class 5 time-division multiplexing
(TDM) equipment to next-generation VoIP multiservice access nodes
(MSANs).

The Comcerto 300 Series of access VoIP processors combines the
company's field-proven system-on-chip (SoC) architecture and
carrier-class software, enabling equipment manufacturers to quickly
and efficiently develop VoIP-to-Ethernet line cards for MSANs,
Ethernet/IP-enabled digital subscriber line access multiplexors
(IP-DSLAMs) and next-generation digital loop carriers (DLCs).

"Our Comcerto 300 Series breaks new ground in what we believe is
an emerging high-volume market opportunity and has already been
selected by several leading vendors for their next-generation access
platforms," said Tom Medrek, senior vice president and general manager
of Mindspeed's multiservice access business unit.

"The opportunity to dramatically lower capital and maintenance
costs while offering multiple revenue-generating services is
encouraging carriers to deploy next-generation IP-packet access
networks. We believe the next major wave of VoIP adoption will replace
traditional Class 5 TDM switching with cost-effective multi-service
access equipment, offering subscribers triple-play voice, video and
data services," Medrek added.

Comcerto 300 Series access processors integrate a complete media
access gateway in a single device by combining signaling and control
processing, packet processing and a rich set of interfaces and
features. By enabling "VoIP on a line card" the Comcerto 300 Series
reduces system complexity and leverages the Ethernet-based access
equipment architectures that already support xDSL termination line
cards. The device family is also well suited for IP-PBX applications.

Technical Details

The Comcerto 300 Series device architecture incorporates two
separate ARM11 processor cores and a DSP array coupled through a
shared memory subsystem to simultaneously provide real-time,
low-latency media processing, as well as call control and call setup
functions. One ARM11 is dedicated to media stream packet processing,
while the second ARM11 is dedicated to the signaling, call-control and
board management functions. This functional division greatly
simplifies software development.

Dual independent Gigabit Ethernet interfaces with integrated
SerDes offer a rich set of configuration options including sGMII
supporting direct backplane connectivity for high availability,
high-reliability MSAN and IP-DSLAM architectures using "dual-star"
Ethernet switch fabric architectures. The device also provides the
ability to generate TDM clocks which are frequency-synchronized to a
TDM network-generated packet stream.

Comcerto 300 Series processors are designed to support narrowband
plain-old telephone service (POTS) line cards from 24 to more than 150
channels including echo cancellation, tone detection and other
narrowband copper loop telephony features. Dual SPI, i2C, two UARTs,
32 GPIOs and an expansion bus connect to a wide array of devices.

Mindspeed also offers a Comcerto 300 Series design kit which
includes a silicon support package software bundle (SiSP) for both
VxWorks(R) and Linux(R). An available Comcerto 300 Series evaluation
module (EVM) provides all necessary memory, a TSI, four FXS POTS
lines, one FXO trunk line, two 10/100/1000BaseT Ethernet interfaces
(with SFP option for optical connectivity), and a T1/E1 interface. The
EVM also includes a system expansion connector designed to mate with
Zarlink Semiconductor's Legerity SLIC/SLAC EVMs, allowing customers to
quickly and easily configure VoIP-enabled POTS systems from 8 to 72
ports.

Pricing and Availability

Comcerto 300 Series M823xx devices are available in five
performance levels and two packaging options (RoHS/standard). Packaged
in a 23x23mm, 1mm pitch BGA, volume production is scheduled in the
third calendar quarter of 2008, with prices ranging between $36 and
$99 per unit in OEM quantities. Samples are available now.

About Mindspeed Technologies(R)

Mindspeed Technologies, Inc. designs, develops and sells
semiconductor networking solutions for communications applications in
enterprise, access, metropolitan and wide area networks.

The company's three key product families include high-performance
analog transmission and switching solutions, multiservice access
products designed to support voice and data services across wireline
and wireless networks, and WAN communications solutions including T/E
carrier physical-layer and link-layer devices as well as ATM/MPLS
network processors.

Mindspeed's products are used in a wide variety of network
infrastructure equipment, including voice and media gateways,
high-speed routers, switches, access multiplexers, cross-connect
systems, add-drop multiplexers and digital loop carrier equipment.

To learn more, visit us at www.mindspeed.com.

Safe Harbor Statement

This press release contains statements relating to Mindspeed, and
our future results, including certain projections and business trends,
that are "forward-looking statements" as defined in the Private
Securities Litigation Reform Act of 1995. Actual results, and actual
events that occur, may differ materially from those projected as a
result of certain risks and uncertainties. These risks and
uncertainties include, but are not limited to: market demand for our
new and existing products and our ability to increase our revenues;
our ability to maintain operating expenses within anticipated levels;
our ability to reduce our cash consumption; availability and terms of
capital needed for our business; constraints in the supply of wafers
and other product components from our third-party manufacturers; our
ability to successfully and cost effectively establish and manage
operations in foreign jurisdictions; our ability to attract and retain
qualified personnel; successful development and introduction of new
products; our ability to successfully integrate acquired businesses
and realize the anticipated benefits from such acquisitions; our
ability to obtain design wins and develop revenues from them; pricing
pressures and other competitive factors; industry consolidation; order
and shipment uncertainty; changes in our customers' inventory levels
and inventory management practices; fluctuations in manufacturing
yields; product defects; and intellectual property infringement claims
by others and the ability to protect our intellectual property, as
well as other risks and uncertainties, including those detailed from
time to time in our Securities and Exchange Commission filings.

Mindspeed Technologies, Inc.
Editorial Contact:
Tom Stites, 949-579-3650
or
Investor Relations Contact:
Simon Biddiscombe, 949-579-6283

Copyright Business Wire 2008