Rudolph Announces Intellectual Property and Asset Purchase from RVSI Inspection LLC

Recent acquisitions keep Rudolph on the back-end fast track
FLANDERS, N.J.--(Business Wire)--Rudolph Technologies, Inc. (NASDAQ:RTEC), a leading provider of
process characterization equipment and software used in wafer
processing and semiconductor final manufacturing (back-end)
facilities, announced today that it has acquired all intellectual
property and selected assets from privately-held RVSI Inspection,
headquartered in Hauppauge, New York. The addition of RVSI's
industry-standard WS-3800 3D bumped wafer inspection system to its
product portfolio is expected to strengthen Rudolph's established
presence in the high-growth, advanced packaging market.

"We are pleased to announce the close of this transaction," said
Paul F. McLaughlin, chairman and chief executive officer of Rudolph.
"This purchase, as well as our recently-announced acquisition of
Applied Precision's probe card test and analysis business, was
orchestrated to enhance our position as a dominant supplier of
inspection and metrology solutions for an increasing number of
back-end applications."

"The RVSI WS-3800 tool is the perfect complement to the Rudolph
NSX(R) 2D macro defect inspection system, which is the workhorse
tool-of-choice deployed in most of the leading fabs around the world,"
McLaughlin continued. "We believe these high-performance systems will
give our customers a comprehensive solution for both 2D and 3D
inspection."

"We will be adding an excellent technical team to our Rudolph
organization, and expect to quickly and efficiently fold the RVSI
operations into our existing inspection business," said Nathan Little,
executive vice president and general manager of the Inspection
Business Unit. "With a high level of customer overlap, combined with
our existing global applications and service support network, our goal
is to make this transition as seamless as possible."

"We're excited about joining the Rudolph team," said Reza Asgari.
vice president of sales at RVSI, who will be joining Rudolph following
the acquisition. "The WS-3800 is a great complement to the Rudolph
inspection product line, and we're looking forward to leveraging the
know-how of our engineering teams to continue delivering advanced
2D/3D bumped wafer inspection capability that our customers demand."

The WS-Series Wafer Inspection System is used by many back-end
manufacturers, with the highest volume found in bump applications. It
performs 3D bump height and coplanarity measurements at high
throughputs while maintaining high accuracy--the "key formula" in
meeting customer expectations in today's high-volume final
manufacturing arena. Using proprietary MicroMap(TM) 3D Laser-based
Triangulation, the system is designed to achieve required inspection
speeds without compromising defect detection.

Consumer demand for thinner and multi-function devices is driving
the market for advanced packaging. As scaling by device shrink becomes
more difficult and expensive, advanced packaging enables increased
package density. According to TechSearch International, demand for
solder bumped wafers, as measured by 200mm wafer equivalents, is
projected to grow at a CAGR of 27% from 2007 to 2010.

Rudolph will maintain a technology center for the wafer scanner
products in Hauppauge, NY, but will relocate the associated
manufacturing activities to its Inspection Business Unit in
Bloomington, Minnesota.

Terms of the transaction were not disclosed. Rudolph will provide
more information on this acquisition in its next earnings call
scheduled for Thursday, February 7, 2008.

Rudolph Technologies is a worldwide leader in the design,
development, manufacture and support of high-performance process
control metrology, defect inspection and data analysis systems used by
semiconductor device manufacturers. Rudolph provides a full-fab
solution through its families of proprietary products that provide
critical yield-enhancing information, enabling microelectronic device
manufacturers to drive down costs and time to market. The company has
enhanced the competitiveness of its products in the marketplace by
anticipating and addressing many emerging trends driving the
semiconductor industry's growth. Rudolph's strategy for continued
technological and market leadership includes aggressive research and
development of complementary metrology and inspection and test
solutions. Headquartered in Flanders, New Jersey, Rudolph supports its
customers with a worldwide sales and service organization. Additional
information can be found on the company's web site at
www.rudolphtech.com.

Safe Harbor Statement

This press release contains forward-looking statements within the
meaning of the Private Securities Litigation Reform Act of 1995 (the
"Act"). In some cases, you can identify those so-called
"forward-looking statements" by words such as "may," "will," "would,"
"should," "expects," "plans," "anticipates," "believes," "feels,"
"estimates," "predicts," "potential," or "continue," or the negative
of those words and other comparable words. Rudolph wishes to take
advantage of the "safe harbor" provided for by the Act and cautions
that actual results may differ materially from those projected as a
result of various factors, including risks and uncertainties, many of
which are beyond Rudolph's control. Factors that could cause actual
results to differ materially from the expectations expressed in such
forward-looking statements, include, but are not limited to, the
impact of the slowdown in the overall economy, the uncertainty of the
current global political environment, the potential for terrorist
attacks, the potential for business disruptions due to infectious
diseases, changes in customer demands for our existing and new
products, the timing, cancellation or delay of customer orders and
shipments, the timing of revenue recognition of shipments, new product
offerings from our competitors, changes in or an inability to execute
Rudolph's business strategy, unanticipated manufacturing or supply
problems and changes in tax rules. Rudolph cannot guarantee future
results, levels of activity, performance, or achievements. The matters
discussed in this press release also involve risks and uncertainties
as summarized in Rudolph's Form 10-K report for the year ended
December 31, 2006 and other filings with the Securities and Exchange
Commission ("SEC"), which are available at http://www.sec.gov, the
SEC's website, and at http://www.rudolphtech.com, the Rudolph website.
While these factors may be updated from time to time through the
filing of reports and registration statements with the SEC, Rudolph
does not assume any obligation to update the forward-looking
information contained in this press release.

Rudolph Technologies
Investors:
Steven R. Roth, 973-448-4302
steven.roth@rudolphtech.com
or
Trade Press:
Virginia Becker, 952-259-1647
virginia.becker@rudolphtech.com

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