Ambric Fellow, Mike Butts, to Present Paper at IEEE FCCM

--(Business Wire)--
Ambric, Inc.:

-0-
*T
WHO: Mike Butts, an Ambric(R), Inc. Fellow and the lead hardware
architect

WHAT: Mr. Butts will present the paper he co-authored with
Ambric's Brad Budlong, Paul Wasson and Ed White. The paper
is entitled "Reconfigurable Work Farms on a Massively
Parallel Processor Array."

WHEN: Tuesday, April 15 in Session 7: Processor-based
Architectures

WHERE: The IEEE Field-Programmable Custom Computing Machines
(FCCM) Conference at the Stanford University Alumni
Center, Palo Alto, Calif.

URL: http://www.fccm.org/

CONTACT: Jean Armstrong, Armstrong Kendall, Inc., 503-672-4680,
jean@akipr.com
*T

About Ambric, Inc.

Ambric is a fabless semiconductor company delivering the world's
first TeraOPS-class device and software development tools that make
massively parallel software programming practical for complex embedded
systems. The company's highly scalable, massively parallel processor
arrays (MPPAs) deliver performance that is more than an order of
magnitude greater than high-end digital signal processors (DSPs) and
provides a programming model that is much easier than what is
available for multiple-DSP platforms. The price-performance exceeds
that of field-programmable gate arrays (FPGAs) for complex
applications, while enabling faster, easier development in software.
Ambric products help companies accelerate time-to-market for their
solutions while slashing their system development costs.

Established in 2003 and headquartered in Beaverton, Ore., Ambric
has received funding from ComVentures, OVP Venture Partners, Northwest
Technology Ventures, and private investors. Visit
http://www.ambric.com for the latest news and information on the
company.

Ambric and the Ambric logo are registered trademarks of Ambric,
Inc. All other trademarks are the property of their respective owners.

Armstrong Kendall, Inc.
Jean Armstrong, 503-672-4680
jean@akipr.com

Copyright Business Wire 2008