eASIC Appoints ASIC and FPGA Industry Expert Mo Movahed as Vice President of Software...

eASIC Appoints ASIC and FPGA Industry Expert Mo Movahed as Vice President of Software Engineering

eASIC Attracts New Vice President to Lead Software Development for
Next Generation Silicon Products
SANTA CLARA, Calif.--(Business Wire)--
eASIC Corporation, a provider of zero mask-charge ASIC devices,
today announced it has appointed Mo Movahed as Vice President of
Software Engineering. Movahed will spearhead the development of design
tools and methodologies for eASIC's current and next generation
silicon products enabling customers to further increase the number of
designs per engineer per year. Movahed will report directly to Ronnie
Vasishta, eASIC President and CEO.

"Mo brings tremendous knowledge and experience to eASIC at this
exciting time of our company's growth," said Vasishta. "Our Nextreme
family is gaining tremendous market acceptance, and we will continue
to simplify the design flow as we aggressively strive to bring
affordable silicon customization to the masses. Mo and his team will
play a pivotal role in helping eASIC achieve this mission."

Mo Movahed brings over 24 years of software engineering experience
in the ASIC and FPGA industry. Most recently, Mo was Vice President of
Engineering at Atrenta, an EDA company, and helped the company to
develop and release RTL analysis and verification tools,. Prior to
that, Movahed was Vice President of Software Engineering at Lattice
Semiconductor, and held senior management positions at Cadence Design
Systems and Xerox Corporation.

"I'm thrilled to be part of eASIC and work with such a talented
team," said Mo Movahed. "eASIC offers a very unique and innovative
solution to address the ASIC market needs. I look forward to helping
the company reach its next stage and fully realize its long-term
potential."

Movahed holds a Bachelors degree in computer engineering from the
University of California, Los Angeles and a Masters degree in
electronic engineering from the University of Southern California
where he worked towards his PhD.

About eASIC

eASIC is a fabless semiconductor company offering breakthrough
zero mask-charge ASIC devices aimed at dramatically reducing the
overall cost and time-to-production of customized semiconductor
devices. Low-cost, high-performance and fast-turn ASIC and
System-on-Chip designs are enabled through patented technology
utilizing Via-layer customizable routing. This innovative fabric
allows eASIC to offer ASICs with no mask-charges and no minimum order
quantity,

Privately held eASIC Corporation is headquartered in Santa Clara,
California. Investors include Khosla Ventures, Kleiner Perkins
Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities
Incorporated and Evergreen Partners. For more information, please
visit www.eASIC.com.

For eASIC
Spencer Horowitz, 408-832-9616
spencerh@ieee.org
http://www.easic.com

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