Palomar Poster Details Assembly Methods for Achieving Brighter LED Modules at the...

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Tue May 20, 2008 8:00am EDT 

Palomar Poster Details Assembly Methods for Achieving Brighter LED Modules at the ECTC Conference

    Palomar Technologies to Exhibit in Booth #119, May 27-30, 2008,
                         Lake Buena Vista, FL
CARLSBAD, Calif.--(Business Wire)--
Palomar Technologies, provider of precision automation equipment,
process development and contract assembly services for
microelectronics, will present a poster titled High Brightness Matrix
LED Assembly Challenges and Solutions at the 58th ECTC Conference,
being held in Lake Buena Vista, FL on May 27-30, 2008. The poster
presents findings detailing how certain matrix LED packaging
technologies can produce brighter LED modules. In addition, visitors
to Palomar's booth #119 can get a better understanding of high
accuracy component placement equipment and methods.

   Palomar's poster features a brief overview of market applications
and package options, using a case study to highlight challenges
encountered and available solutions for producing matrix LED packages.
Pulse heat eutectic die attach and wire chain bonding are some of the
technologies that will be explored for application to matrix LED
assembly.

   "LED lighting capabilities already match those of incandescent
lighting for many applications and are anticipated to begin replacing
fluorescent lighting by 2012," said Daniel Evans, senior scientist at
Palomar Technologies. "To reach the performance and cost targets to
achieve that will require continuous improvements in LED devices and
packaging to extract ever increasing lumens per watt. New high bright
LED applications require maximum thermal transfer to achieve
performance requirements. Palomar has developed assembly methods to
place LEDs as close as part tolerances allow, while at the same time
managing the heat concerns and producing maximum LED brightness."

   About Palomar Technologies

   Palomar Technologies (formerly part of Hughes Aircraft Company) is
one of the world's principal suppliers of automated high-precision
wire bonders and component placement systems along with process
development and contract assembly services to increase yield and lower
costs for manufacturers of optoelectronic, RF, and microelectronic
packages in the LED, wireless, photonic, microwave, photovoltaic,
computer, automotive, aerospace, and medical industries.

   Talk with Palomar's experts about your application needs. The
ultra-high accuracy of the Model 6500 (down to 1.5 micron 3 sigma) or
the extra-large work area of the Model 3500 may be just the capability
your company is looking for. For more information on Palomar
Technologies and Palomar Microelectronics, visit
http://www.palomartechnologies.com or phone 760-931-3600.

Palomar Technologies, Inc.
Bradley Benton, 760-931-3600
Fax: 760-931-5191
bbenton@bonders.com
or
Palomar Technologies Pte Ltd
Wai Seng Chew, (65)-6779-2766
Fax: (65)-6779-7939
wschew@bonders.com
or
Palomar Technologies GmbH
Josef Schmidl, 49-9131-48009-30
Fax: 49-9131-48009-55
jschmidl@bonders.com
or
A--R Marketing, Inc. (Agency)
Andrea Roberts, 858-451-8666
Fax: 858-683-2083
andrea@armarketinginc.com

Copyright Business Wire 2008
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