KLA-Tencor Launches New Archer 200 Overlay Metrology System for 32nm Lithography...

KLA-Tencor Launches New Archer 200 Overlay Metrology System for 32nm Lithography Control

SAN JOSE, Calif.--(Business Wire)--
KLA-Tencor (NASDAQ:KLAC) today introduced its latest overlay
metrology system, the Archer 200, featuring an enhanced optical system
that provides significant performance improvements that are critical
to help customers meet the much tighter overlay requirements for
double-patterning lithography at the 32nm design rule node.

"Overlay budgets for 32nm designs are stretched to the limit,
especially with double patterning technologies, and chipmakers are
seeking to increase both accuracy and speed of their overlay systems,"
said Ofer Greenberger, vice president and general manager of
KLA-Tencor's Overlay Metrology group. "Our new Archer 200 system
extends the performance advantages of our well-understood optical
imaging technology to meet all layer requirements for 32nm lithography
control, and many of its enhancements can be upgraded to the large
Archer installed base for maximum return on investment. Our close
relationship with major lithography suppliers has resulted in key
enhancements in high-order overlay control, which is already resulting
in more advanced scanner correction and monitoring that can help
chipmakers with their double patterning implementation."

As part of KLA-Tencor's continued focus upon advanced imaging
technology to serve the company's overlay roadmap going forward, its
engineers have made major improvements to the Archer 200 system's core
optical design. These developments enable over 50% improvement in tool
matching specification and 25% higher productivity over the
previous-generation Archer system. Matching is a critical metric in
overlay metrology because different systems must achieve virtually
identical layer alignment. The enhanced optical system also features a
redesigned light path that passes more light, for faster measurement
that equates to higher throughput. New camera management algorithms
enable faster system operation and lower noise, again improving
throughput and accuracy.

The 32nm design rule node brings two unique challenges for overlay
metrology; increased chip density and lithography double patterning.
To overcome these challenges customers must increase overlay sampling,
and utilize advanced overlay targets more effectively. The Archer 200
lets chipmakers use the industry-standard AIM(TM) target, or even
smaller "micro-AIM" targets that can be inserted into different
locations within the chip itself. This enhanced overlay target
capability enables maximum scanner alignment and hence, device yield.

Customers also have the option of adding KLA-Tencor's advanced
scatterometry measurement technology to the Archer 200 to provide
increased flexibility in meeting their specific 32nm and beyond
dimensional metrology requirements. The Archer 200 system offers an
optional module that features advanced scatterometry overlay
(SCOL(TM)) measurement. This option, which enables sub-nanometer Total
Measurement Uncertainty, allows interested customers to begin working
with the SCOL technology without the need for multiple dedicated
systems.

Archer 200 systems are already being used by multiple chipmakers
in the U.S., Europe and Korea for 45nm production and 32nm
development, for both logic and memory fabs.

About KLA-Tencor: KLA-Tencor is the world leader in yield
management and process control solutions for semiconductor
manufacturing and related industries. Headquartered in San Jose,
California, the Company has sales and service offices around the
world. An S&P 500 company, KLA-Tencor is traded on the NASDAQ Global
Select Market under the symbol KLAC. Additional information about the
Company is available at http://www.kla-tencor.com.

Archer 200 Technology Summary

Double-patterning lithography (DPL) requires more patterning
steps, leading to more overlay measurement steps for multiple
exposures. Combined with shrinking design rules, DPL results in a
step-function reduction in overlay metrology budgets permissible on
the metrology tools.

Redesigned Optical System

The Archer 200's new optical system provides a significant imaging
performance improvement, plus high throughput, for tighter
specifications across the board.

-- Designed to address 32nm node challenges with AIM target
technology and microAIM targets with advanced analysis,
enabling high-order control and multi-layer metrology for
double patterning.

-- Higher productivity with 20% faster Move-Acquire-Measure (MAM)
time (0.6s)

-- Greater than 25% tighter specifications for total measurement
uncertainty (TMU) (1.0nm)

-- 30-50% better matching

-- 20% improved Tool Induced Shift (TIS) (0.8nm)

-- Greater measurement repeatability

Improved Higher-Order Overlay Control

Double-patterning in 32nm-generation lithography requires both
higher-order, non-linear modeling, as well as better field- and
grid-level scanner alignment and efficiency. Recent data has shown
that overlay control improves significantly with the transition from
linear to higher-order models. High-order grid and field correction
enables significantly better metrology cost of ownership than
high-order grid correction alone.

Scatterometry Overlay (SCOL) Technology

Standard optical imaging technology reaches very high capabilities
in terms of performance and total measurement uncertainty; however,
SCOL-based technology complements classic metrology and mitigates
potential risks that might arise in advanced processes. However, since
both scatterometry and imaging-based technologies show excellent
performance, the use of one over the other should be decided on a
case-by-case basis. The combination of optical imaging and SCOL is a
unique low-risk configuration with excellent accuracy and matching to
AIM targets.

-- Combination of imaging and SCOL has best return on investment
(ROI) and cost of ownership (CoO): Highest throughput;
maintains process-of-record (POR) existing targets; shortens
development cycle.

-- Provides the flexibility to measure all layers with no tool
dedication needed

-- Upgrade path from existing installed base

-- Extendibility to next-generation products that combine overlay
and OCD metrology

KLA-Tencor, Inc.
Charles Lewis, 408-875-9037
Director, Global Public Relations
charles.lewis@kla-tencor.com

Copyright Business Wire 2008