Linear Technology and Microbonds Announce Qualification of X-Wire(TM) Technology

MILPITAS, Calif. & TORONTO--(Business Wire)--
Linear Technology Corporation (NASDAQ:LLTC) and Microbonds Inc. (a
private Canadian corporation) have announced successful qualification
of Microbonds X-Wire(TM) insulated wire bonding technology to enable
design flexibility for Linear Technology's advanced IC packages.

The increasing global demand for electronics is driving the need
for greater performance capabilities of advanced integrated circuits
to be squeezed into smaller geometries and shrinking form factors.
Microbonds' X-Wire(TM) insulated bonding wire technology is a
nano-scale material breakthrough that addresses many of the difficult
interconnect challenges arising from increasingly complex single and
3D stacked die packaging designs.

Over a period of 2 years, Linear Technology performed a
comprehensive set of manufacturability and reliability testing using
X-Wire(TM) on high voltage applications with a gold-based coated
bonding wire. X-Wire(TM) passed all test criteria, meeting industry
standards including JEDEC J-STD-020C MSL Level 1 and JESD22-A
reliability standards. X-Wire(TM) also successfully achieved Linear
Technology's stringent internal electrical and functional test
requirements.

Linear Technology is targeting X-Wire(TM) to be used on a number
of product lines to increase capability and shorten product and
development and package design cycle time, while using the existing
low cost assembly infrastructure. "X-Wire Technology will enable us to
pack more chip functionality into standard packages permitting bonding
wires to now touch and cross in 3D space, without risk of electrical
failure. This allows us the flexibility to connect chips in ways that
were not possible before", said Greg Peck, Director of Engineering at
Linear Technology.

About Linear Technology

Linear Technology Corporation designs, manufactures and markets a
broad line of standard high performance integrated circuits.
Applications for the Company's products include telecommunications,
cellular telephones, networking products, notebook and desktop
computers, video/multimedia, industrial instrumentation, automotive
electronics, factory automation, process control and military and
space systems. The Company's principal product categories include
amplifiers, battery management, data converters, high frequency,
interface, voltage regulators and voltage references. For more
information, see http://www.linear.com

About Microbonds Inc.

Microbonds Inc. is a pioneer in the development and licensing of
insulated bonding wire technology for semiconductor packaging and
devices. Founded in 1999, the company's approach is proven through
testing with major IC companies and alliances with the industry supply
chain. For more information, see http://www.microbonds.com

Microbonds , X-Wire and X-Wire Technology are trademarks of
Microbonds, Inc.

Microbonds Inc.
Mr. William Crockett, 408-504-4971
bcrockett@microbonds.com
or
Linear Technology
1630 McCarthy Blvd.
Milpitas, CA 95035-7417
Phone: 408-432-1900
Fax: 408-434-0507

Copyright Business Wire 2008