NEXX Systems Ships Stratus 300 mm Tool to a Singapore Customer

BILLERICA, Mass.--(Business Wire)--
NEXX Systems today announced that it has shipped a Stratus S300
(300 mm) electrodeposition system to Singapore, representing the
second Stratus 300 mm tool to be installed at this company for
high-volume production. With the inherent simplicity of the Stratus,
NEXX anticipates production start-up in August.

"This shipment," stated Richard Post, CEO of NEXX Systems,
"represents an important milestone in the market acceptance of the
Stratus platform. We now have multiple customers who are purchasing
follow-on Stratus tools to handle their high-volume production
requirements in both 200 and 300 mm packaging applications."

The Stratus provides industry-leading yield at the lowest cost of
ownership for pattern plating and TSV applications. Innovative
ShearPlate(TM) technology eliminates the complex process tuning and
process drift adjustment required by competing multi-zone anode
fountain tools. The Stratus is the technology leader for TSV, solder
bumping, copper pillar, UBM, and other advanced packaging
applications.

About NEXX Systems: NEXX Systems brings exceptional technical
expertise to flip chip and advanced packaging. Our product lines
provide the most efficient, yet affordable, systems of their kind:
Apollo for multi-layer sputter deposition of metals, and Stratus for
high throughput electrodeposition of metals. Additional information
can be found at: www.nexxsystems.com.

"Safe Harbor" statement: This release may contain forward-looking
statements within the meaning of the Private Securities Litigation
Reform Act of 1995 regarding future events or the future performance
of NEXX Systems. These statements are only predictions. Actual events
or results may differ materially from those in other forward-looking
statements set forth herein. Among the important factors that could
cause actual events to differ materially from those in other
forward-looking statements are potential fluctuations in quarterly
results, dependence on new product development, rapid technological
and market change, acquisition strategy, manufacturing and sourcing
risks, volatility of stock price, international operations, financial
risk management, and future growth subject to risks. NEXX Systems is
under no obligation to, and expressly disclaims any obligation to,
update or alter its forward-looking statements, whether as a result of
new information, future events or otherwise.

NEXX Systems
Richard S. Post, 978-932-2030
Chief Executive Officer

Copyright Business Wire 2008