Elpida Ready to Launch World's Largest Capacity (16-Gigabyte) FB-DIMM

* Reuters is not responsible for the content in this press release.

Tue Aug 5, 2008 3:49am EDT

Power Consumption Comparable to Existing 8-Gigabyte Products
TOKYO--(Business Wire)--
Elpida Memory, Inc. (Elpida), Japan's leading global supplier of
Dynamic Random Access Memory (DRAM), announced today that it is ready
to launch 16-gigabyte Fully Buffered DIMM (FB-DIMM), the world's
largest capacity FB-DIMM. Based on its own unique integrated packaging
technology (stacked FBGA or sFBGA) with 2-gigabit DDR2 SDRAM Elpida
has achieved development of FB-DIMM products that feature an ultra
thin thickness of 7.7mm along with the world's largest capacity of 16
gigabytes.

   Elpida's new FB-DIMM incorporates high-end DIMM circuit board
design and simulation verification technique. It features Elpida's
unique heat spreader design to meet the need for larger capacity and
for more stringent thermal and reliability requirements. In addition
to achieving greater memory density and multiple-rank function to
significantly upgrade system performance Elpida has applied 2-gigabit
DDR2 low-power DRAMs and IDT's low-power AMB device to achieve a level
of power consumption comparable to existing 8-gigabyte products and to
contribute to lower system power requirements.

   "Elpida has combined low-power technology and high-density
stacking technology to achieve the world's largest capacity
16-gigabyte FB-DIMM," said Yasushi Takahashi, an Elpida executive
officer and division manager of the company's Server & PC division.
"We believe our new DIMM product is an excellent response to server
market demand -- for example, from data center customers -- for
low-power and high-density performance. Elpida continues to focus on
developing products featuring superior low-power, high-density
characteristics."

   "IDT is proud to collaborate with Elpida in developing the world's
largest capacity FB-DIMM. The inclusion of the IDT low power AMB
device helps Elpida achieve twice the capacity without impacting power
consumption, which is critically important for today's power-hungry
computing platforms," said Sean Fan, vice president and general
manager of Memory Interface Division at IDT.

   Sample shipments of the new 16-gigabyte FB-DIMM will begin later
this month. Mass production is expected to get underway in the 4Q of
CY 2008.

   Elpida intends to complement its presence in existing markets by
using its new large-capacity FB-DIMM as a vehicle to enter new
markets, such as FB-DIMM for ultra high-end servers and work stations.

-0-
*T
New Product Features:

Part Number          EBE18FF4ABHR
----------------------------------------------------
Speed                PC2-6400F (800Mbps)
                     PC2-5300F (667Mbps)
----------------------------------------------------
Monolithic device    2G-bit DDR2 SDRAM x 72 (sFBGA)
----------------------------------------------------
Pin assign           JEDEC compliant 240-pin
----------------------------------------------------
*T

   About Elpida

   Elpida Memory, Inc. (TOKYO:6665) is a leading manufacturer of
Dynamic Random Access Memory (DRAM) integrated circuits. The company's
design, manufacturing and sales operations are backed by world class
technological expertise. Its 300mm manufacturing facilities,
consisting of its Hiroshima Plant and a Taiwan-based joint venture,
Rexchip Electronics, utilize the most advanced manufacturing
technologies available. Elpida's portfolio features such
characteristics as high-density, high-speed, low power and small
packaging profiles. The company provides DRAM solutions across a wide
range of applications, including high-end servers, mobile phones and
digital consumer electronics. More information can be found at
http://www.elpida.com.

   Information in this news release is current as of the timing of
the release, but may be revised later without notice.

Elpida Memory, Inc. (Japan)
Kumi Higuchi, +81-3-3281-1648
Corporate Communication Group
press@elpida.com

Copyright Business Wire 2008
Comments (0)
This discussion is now closed. We welcome comments on our articles for a limited period after their publication.