ZTE Selects Tundra Semiconductor for Next Generation Platform

Tundra's PCI Express Product Brings Maximum Performance to New Graphics
Card

OTTAWA, Aug. 27 /PRNewswire-FirstCall/ - Tundra Semiconductor Corporation
(TSX:TUN), a leader in System Interconnect, has been selected by ZTE
Corporation, a leading global provider of telecommunications equipment and
network solutions, to supply Tundra's high performance PCI Express(R) product
for ZTE's Next Generation Platform System Graphics Card.
ZTE selected Tundra's high performance semiconductor to improve overall
performance on its new Graphics Card. Tundra's high performance semiconductor
has typical power consumption of 1.3W, and incorporates power management to
minimize power consumption during operation. In addition, the Tundra's PCI
Express product offers the flexibility, high performance, small footprint, low
power consumption and drop-in compatibility that ZTE required for its new
design.
"Tundra's high performance PCI Express semiconductor is the best fit for ZTE's
Next Generation Platform Graphics Card. Our engineers evaluated several other
products available on the market and found that Tundra offered the best
performance and power against the competition. Our designs require the best
technology to solve our customers' needs and Tundra's interconnect solutions
are the best the market has to offer," said Mr. Zhu Baowang, Project Manager,
Design and Development Dept., Central Research Institute, ZTE . "The design
support provided by Tundra is second-to-none in the industry and ZTE continues
to rely on Tundra's industry-leading interconnect expertise."
"We are proud to work with ZTE on their new designs. Tundra is committed to
the expanding China market and we are pleased to partner with global leaders
such as ZTE to bring new technologies to the industry," said Daniel Hoste,
President and Chief Executive Officer, Tundra Semiconductor. "Tundra's PCI
Express products offer the best performance features on the market today and
are backed by Tundra's world-class design support tools, development platforms
and customer support," continued Hoste.

About ZTE

ZTE is a leading global provider of telecommunications equipment and network
solutions. The ZTE product range is the most complete in the world - covering
virtually every sector of the wireline, wireless, service and terminals
markets. The company delivers innovative, custom-made products and services to
customers in more than 135 countries, helping them to achieve continued
revenue growth and to shape the future of the world's communications. ZTE
commits around 10% of annual turnover to research and development and takes a
leading role in a wide range of international bodies developing emerging
telecoms standards. It is the fastest growing telecoms equipment company in
the world, and is China's only listed telecoms manufacturer, with shares
publicly traded on both the Hong Kong and Shenzhen Stock Exchanges. In the
Asian Wall Street Journal's Readers' Survey 2007, ZTE was among the Top 10
Most Admired Companies in China, the only company that was included in the Top
10 list representing the telecom industry. ZTE was awarded the "Most Promising
Vendor of the Year" by Frost & Sullivan in its 2007 Asia Pacific ICT Awards,
and was reported as the fastest growing telecom equipment and solutions
provider among the major telecom vendors worldwide by IDC in 2007. ZTE was
included in BusinessWeek's 2006 ranking of China's Top 20 Brands. For more
information, please visit www.zte.com.cn.

About Tundra

Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with System Interconnect
products, intellectual property (IP) and design services backed by world-class
customer service and technical support. Tundra's track record of product
leadership includes over a decade of bridges and switches enabling key
industry standards: RapidIO(R), PCI, PCI-X, PCI Express(R), Power
Architecture(TM), VME, HyperTransport(TM), Interlaken, and SPI4.2. Tundra's
products deliver high functional quality and simplified board design and
layout, with specific focus on system level signal integrity. Tundra's design
services division, Silicon Logic Engineering, Inc., offers industry-leading
ASIC and FPGA design services, semiconductor intellectual property and product
development consulting. Tundra's technology connects critical components in
high performance embedded systems around the world. For more information,
please visit www.tundra.com.
TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor
Corporation in Canada, the United States, the European Union and the People's
Republic of China. Design.Connect.Go. are trademarks of Tundra Semiconductor
Corporation. Other registered and unregistered trademarks are the property of
their respective owners.

(C) Copyright 2008 Tundra Semiconductor Corporation. All rights reserved.
Information subject to change without notice.
SOURCE TUNDRA SEMICONDUCTOR CORPORATION

Keri Zeran, Director Marketing Communications, (613) 592-0859 ext. 1744,
Mobile: (613) 697-6788, keri.zeran@tundra.com; Mr.Zhu Baowang, Project
Manager, Design & Development Dept., Central Research Institute, ZTE Co.,Ltd.,
+86-25-52877483, Mobile: +86-13951899070, zhu.baowang@zte.com.cn