Sonics OCP Library for Verification Now Shipping

SOLV Enables Validation of OCP Socket Interfaces and Performance
Analysis
MILPITAS, Calif.--(Business Wire)--
Sonics Inc., a premier supplier of system-on-chip (SoC) SMART
Interconnect solutions, today announced the general availability of
the Sonics OCP Library for Verification (SOLV). Core designers are
using the SOLV package for debugging, performance tuning and
validation of complex intellectual property (IP) cores using OCP
interfaces.

The SOLV package includes Sonics SVA OCP Checker, OCP disassembler
(ocpdis2) and OCP performance analyzer (ocpperf2). Together, this
suite of tools enable validation of OCP socket interfaces and the
analysis of their performance.

The Sonics SVA OCP Checker validates OCP sockets for protocol
compliance during simulation and generates OCP trace files for use by
post-processing tools. The tool enables users to quickly and
efficiently identify OCP protocol violations at each socket. Full OCP
protocol compliance checking ensures that the macro blocks
interconnected are free from communication defects. The checker
supports the full set of protocol compliance checks as defined by the
OCP-IP community.

The OCP disassembler (ocpdis2) allows the display of OCP
connection activity in a convenient, readable, report format. The data
captured during simulation can be used to understand traffic
conditions in the design.

The ocpperf2 processes ocpdis2-produced trace files to measure the
performance of OCP transfers and burst transactions. Using this
information, a designer can individually tune OCP socket performance
to balance the on-chip traffic for any given application.

"Sonics is committed to helping our customers improve the quality
and performance of their designs," said Ray Brinks, vice president of
engineering at Sonics, Inc. "SOLV addresses universal needs of core
designers. We are seeing a large interest in this package across
vertical industries."

"The issues and challenges surrounding verification in multicore
design are many, and from its inception OCP has been designed and
evolved to ease some of these challenges," said Ian Mackintosh
president and chairman of OCP-IP. "We are extremely pleased to see
Sonics leverage its extensive expertise to assist OCP users increasing
the quality and performance of their designs."

About Sonics

Sonics Inc. supplies critical semiconductor intellectual property
for SoCs. Its customers see the benefits of high design predictability
and increased design efficiency. Sonics solutions address the growing
complexity found in consumer products with voice, data and video
features. Major semiconductor and systems companies including
Broadcom, Samsung, Texas Instruments and Toshiba leverage Sonics'
technology in leading products in the wireless, digital multimedia and
communications markets. For more information, see www.sonicsinc.com.

(R)Sonics Inc., the company's logo and SMART Interconnect are
registered trademarks of Sonics Inc. All other trademarks are the
property of their respective owners.

Fast Forward Public Relations
Mary Jane Reiter, 408-725-1239 (Media)
mjreiter@sbcglobal.net

Copyright Business Wire 2008