Surfect Technologies Appoints Richard Tung as Vice President of Operations

TEMPE, Ariz. Oct. 23 Surfect Technologies, Inc.
(OTC Bulletin Board: SUFH), a leading provider of advanced interconnect and
packaging solutions for solar cell, LED and power management applications,
today announced the appointment of Richard Tung to the position of Vice
President of Operations.

Mr. Tung has held general management and operations management positions in
the United States and Asia Pacific region for over 25 years. Prior to joining
Surfect, he was the Director of Manufacturing Engineering for Cypress
Semiconductor. Mr. Tung was responsible for cost improvements, the corporate
environmental green program, and automation of the Cypress manufacturing
process. Previously, Mr. Tung was with Amkor Technology for over ten years.
He held a variety of engineering and management positions, eventually gaining
the title of Vice President of Quality Engineering. He was responsible for
interfacing with both customers and factories to resolve quality related
issues as well as implementing change control procedures and quality
improvement programs. Mr. Tung has also held senior operations positions with
National Semiconductor and Texas Instruments. He holds a Master of Science in
Chemistry from the University of Malaya and a Master of Business
Administration from the University of Phoenix.

Steve Anderson, chief executive officer of Surfect, commented, "We are
delighted to welcome Richard to Surfect as Vice President of Operations. He
has a long history of success in both management and engineering positions and
we are confident that his experience in quality enhancement, streamlining
operations, and reducing overall manufacturing costs will be an asset to our
company as we establish our Asian manufacturing operations. We look forward
to his extensive factory and product ramp-up expertise as we support customers
with both tools and advanced process metallization and module interconnect
solutions. We feel that Richard's unique experience, supporting and
developing tools using the Asian manufacturing base as well as packaging
outsourced development, will enable us to provide stronger support to clients
as module capacity ramps up worldwide and extends to the Asian marketplace.
Through low-cost manufacturing, we can further help solar companies achieve
grid parity utilizing our DEP technology, which in turn will help our
customers improve margins, increase yields and generate higher energy output."

About Surfect Technologies
Surfect develops and manufactures advanced interconnect solutions that are
designed to support the growing demand for solar cell production by reducing
the cost per delivered watt. The company's proprietary Direct Energy
Plating(TM) (DEP) is an innovative multi-wafer capable, single-cell
electroplating process that uses ultrasonic energy to create the metal
interconnect on the silicon wafers. The computer-driven DEP process is a
"plug-and-play" plating and integrated packaging solution that provides
customers with benefits such as a lower cost of ownership, improved process
speeds and yields, environmentally sensitive processes, increased operational
flexibility and a smaller operational footprint. Additional information about
the company is available at www.surfect.com.

The information in this release may include "forward-looking statements"
within the meaning of the Private Securities Litigation Reform Act of 1995
that involve risks and uncertainties, particularly statements anticipating
future growth in revenues. Words such as "anticipates," "estimates,"
"expects," "projects," "intends," "plans," "believes" and words and terms of
similar substance used in connection with any discussion of future operating
or financial performance identify forward-looking statements. There can be no
assurances that forward-looking statements will be achieved, and actual
results could differ materially from those suggested by the forward-looking
statements. Important factors that could cause actual results to differ
materially include: the completion and filing of the applicable documents with
the Securities and Exchange Commission and the Company's fulfillment of the
obligations under the applicable indentures. Therefore, any forward-looking
statements in this release should be considered in light of various important
factors, including the risks and uncertainties listed above, as well as
others. The Company makes no commitment to revise or update any
forward-looking statements in order to reflect events or circumstances after
the date any such statement is made.

SOURCE Surfect Technologies, Inc.

CONTACT: U.S. Investors: David K. Waldman or Klea Theoharis, both of Crescendo
Communications, LLC, +1-212-671-1020; or for European Investors: Shaun Brown
of Innovator Capital, +44 (20) 7297 6840; or for Media: Chenoa Taitt of Rooney
& Associates, +1-212-223-0682