SMIC Successfully Developed 0.11 Micron CIS Process Technology

SHANGHAI, China, Oct. 23 /Xinhua-PRNewswire/ -- Semiconductor
Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 0981.HK),
one of the leading semiconductor foundries in the world, today announced that
it has successfully developed a 0.11 micron CMOS image sensor (CIS) process
technology. With this new production process, SMIC-manufactured CIS devices
exhibit improved resolution, low noise, and enhanced image contrast for high
performance CMOS imager applications.
SMIC offers complete CIS foundry service in China, and its CIS 0.11um
capability builds on its extensive experience in the field, giving customers a
leading edge solution at competitive costs while complementing its existing
0.18um and 0.15um CIS technologies. The 0.11um CIS technology, available with
both aluminum and copper backend metalization, for highly integrated, high
density CIS solutions, is ideal for a wide range of applications, including
camera phones, computer cameras, and industrial and security monitoring
devices. SMIC has begun pilot production for customers to take full advantage
of this proven technology, which can be manufactured on 200mm and 300mm
wafers.
Paul Ouyang, SMIC vice president of marketing and sales said, "Using
optimized process conditions, we've successfully reduced dark noise, enabling
performance in low light environments. These features deliver to our customers
a high performance product at a reasonable cost, which allows them to enhance
their competitiveness and gain leading positions in an ever-growing CIS
market."
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI;
SEHK: 981) is one of the leading semiconductor foundries in the world and the
largest and most advanced foundry in Mainland China, providing integrated
circuit (IC) manufacturing service at 0.35 micron to 65 nanometer and finer
line technologies. Headquartered in Shanghai, China, SMIC has a 300-millimeter
wafer fabrication facility (fab) and three 200 mm wafer fabs in its Shanghai
mega-fab, two 300 mm wafer fabs in its Beijing mega-fab, a 200 mm wafer fab in
Tianjin, and an in-house assembly and testing facility in Chengdu. SMIC also
has customer service and marketing offices in the U.S., Europe, and Japan, and
a representative office in Hong Kong. In addition, SMIC manages and operates a
200 mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing
Corporation and a 300 mm wafer fab in Wuhan owned by Wuhan Xinxin
Semiconductor Manufacturing Corporation. For more information, please visit
http://www.smics.com .
For more information, please contact:

SMIC Shanghai
Peter Lin
Public Relations
Tel: +86-21-5080-2000 x12349
Email: Peter_LHH@smics.com

SMIC Shanghai
Angela Miao
Public Relations
Tel: +86-21-5080-2000 x10088
Email: Angela_Miao@smics.com

SOURCE Semiconductor Manufacturing International Corporation

SMIC Shanghai - Peter Lin, Public Relations, +86-21-5080-2000 ext. 12349, or
Peter_LHH@smics.com; SMIC Shanghai - Angela Miao, Public Relations,
+86-21-5080-2000 ext. 10088, or Angela_Miao@smics.com