StratEdge Introduces Low-Profile, High-Power Switch Package for GaN, SiC, and GaAs Devices
* Reuters is not responsible for the content in this press release.
Provide Complete Turnkey Package Assembly and Test Services SAN DIEGO--(Business Wire)-- StratEdge, leader in the design and production of semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces a Beryllium Oxide (BeO) package and full assembly and testing services for high power semiconductor switches and small Gallium Nitride (GaN), Silicon Carbide (SiC), and Gallium Arsenide (GaAs) devices. Applications for these packages include test and measurement, military radios, and radar. The StratEdge BeO package has a thermal conductivity of 270 watts/meter Kelvin (w/mK). The 0.205 inch diameter circular package has a BeO disk base to accommodate devices of up to 0.030 by 0.040 inches. This standard hermetic package comes with a circular metal lid with gold tin preform. The package is designed with four leads to accommodate single pole, three throw switch (SP3T) devices. The maximum assembled package height, including the lid, is 0.056 inches. "Their small size and ability to draw a considerable amount of heat away from tiny high power devices make StratEdge`s BeO packages perfect for older technology silicon diodes as well as newer silicon carbide and gallium nitride devices," explained Tim Going, president and CEO of StratEdge. "We have worked with many of our clients who manufacture semiconductor switches to perfect these packages. For companies looking for a turnkey switch solution, StratEdge can obtain the devices, assemble, test, and deliver them directly to you or your customer." StratEdge assembly services are performed at StratEdge headquarters in San Diego, CA. They include eutectic or epoxy die attach, gold or aluminum wedge-to-wedge thermosonic wire bonding, lidding, lead trimming, marking, bulk packaging, and testing. The BeO packages are available as part of StratEdge`s new high power family of products. The Power Package family features thermally enhanced packages in many shapes, sizes, and lead counts. The materials used in the packages have matched coefficients of expansion to mitigate the inherent stresses of brazing dissimilar materials together. All packages are designed for high reliability and offer excellent RF performance over the range of the device. StratEdge packages are capable of passing MIL-STD 883 fine and gross hermeticity testing and meet RoHS and WEEE compliance standards. Image available at http://theedge.cts.com/580483_outline.pdf About StratEdge StratEdge, founded in 1992, designs, manufactures, and provides test and assembly services for a complete line of high performance semiconductor packages operating from DC to 50+ GHz for the high speed digital (OC-48, OC-192, OC-768), mixed signal, broadband wireless, satellite, point-to-point/multipoint, VSAT, and test and measurement industries, as well as aerospace stripline filters. StratEdge offers ceramic, low cost molded ceramic, and metal packages. All packages are lead-free and most meet RoHS and WEEE standards. For more information contact StratEdge at 866-424-4962, email: info@stratedge.com, or visit our website at www.stratedge.com. StratEdge Tim Going, 866-424-4962 t.going@stratedge.com or A-R Marketing, Inc. Andrea Roberts, 858-451-8666 andrea@armarketinginc.com Copyright Business Wire 2009
Comments (0)
This discussion is now closed. We welcome comments on our articles for a limited period after their publication.


Follow Reuters