Reportlinker Adds World Advanced Electronic Packaging Market Report

NEW YORK--(Business Wire)--
Reportlinker.com announces that a new market research report is available in its
catalogue.

World Advanced Electronic Packaging Market

http://www.reportlinker.com/p098259/World-Advanced-Electronic-Packaging--Market.html

This report analyzes the worldwide markets for Advanced Electronic Packaging in
Millions of US$. The specific product segments analyzed are Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules. The report provides separate
comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and
Rest of World. Annual forecasts are provided for each region for the period of
2000 through 2015. The report profiles 77 companies including many key and niche
players worldwide such as Advanced Semiconductor Engineering Group, ASAT
Holdings Limited, STATS ChipPAC Ltd., Amkor Technology Inc., ASM International
NV, ASM Pacific Technology Ltd., CARSEM, Chipbond Technology Corp, ChipMos
Technologies, FlipChip International, Fujitsu Ltd, NEC Electronics Corporation,
Orient Semiconductor Electronics, Sliconware Precision Industries Co., Ltd.,
STATS ChipPAC Ltd., Tessera, Inc., Toshiba America Electronic Components Inc.,
and Market data and analytics are derived from primary and secondary research.
Company profiles are mostly extracted from URL research and reported select
online sources.

ADVANCED ELECTRONIC PACKAGING MCP-1203 A GLOBAL STRATEGIC BUSINESS REPORT

CONTENTS

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations I-1 Disclaimers I-2 Data
Interpretation & Reporting Level I-2 Quantitative Techniques & Analytics I-3
Product Definitions and Scope Of Study I-3 Ball Grid Arrays I-3 Chip Scale
Packaging (CSP) I-3 Multi Chip Modules (MCM) I-3

II. EXECUTIVE SUMMARY

1. Current and Future Analysis II-1 Industry Faces Challenging Times II-1

2. Industry Overview II-2 A Brief Insight II-2

Table 1: Semiconductor Capital Equipment Market Worldwide (2005) - Percentage
Breakdown of Dollar Revenues by Region: Japan, North America, Korea, Taiwan,
Europe, and Rest of World (include corresponding Graphs/Chart) II-2

Table 2: Semiconductor Plastic Packaging Materials Market Worldwide (2005) -
Percentage Breakdown of Dollar Revenues by Geographic Region- Southeast Asia,
Japan, Taiwan, Korea, China, and Rest of World (include corresponding
Graphs/Chart) II-2 Advanced Electronic Packaging Technology Trends (2000-2015)
II-3

Table 3: Laminate Substrate Market Worldwide (2005) - Percentage Breakdown by
Technology- Flip Chip, Wire Bond, and Chip Scale Packaging (include
corresponding Graphs/Chart) II-3

Table 4: Leading Fabless Packaging Techniques Worldwide (2004 & 2005) -
Percentage Share Breakdown for QFP, BGA, SOIC, Leadless, CSP, FBGA, Discrete and
Other (include corresponding Graphs/Chart) II-3

Table 5: Leading Foundry Manufacturing Regions Worldwide (2004 & 2005) -
Percentage Share Breakdown for Taiwan, Singapore/Malaysia, Korea, China,
Philippines, and Other (include corresponding Graphs/Chart) II-4 Market Share
Scenario II-4

Table 6: Leading IC Socket Manufacturers Worldwide (2004 & 2005) - Percentage
Share Breakdown for Yamaichi, AMP, Molex, Thomas & Betts, FCI/Berg, and Others
(include corresponding Graphs/Chart) II-4

Table 7: Leading CSP Substrate Suppliers Worldwide (2004 &2005) - Percentage
Share Breakdown for Unimicron, Ibiden, Shinko, JCI, Samsung, LG, and Others
(include corresponding Graphs/Chart) II-5

Table 8: Leading Chip Packaging Manufacturers Worldwide (2004 & 2005) -
Percentage Share Breakdown for Amkor, ASE, ChipPac, Siliconware, Orient, STATS,
ASAT, and Others (include corresponding Graphs/Chart) II-5

3. Issues and Trends II-6 Suppliers Outsource Packaging To Curtail Costs II-6
BGAs on a Tremendous Growth Path II-6 Glue Logic Makers Move to Advanced
Packaging II-6 Contractors Move Towards High Pin-Count Packages II-7 Wafer Scale
Packaging Anticipated to Cut Costs II-7 Disparity in Scale Sizes - A Reason for
Concern II-7 Miniaturization Impels Adoption of Wafer-Level Chip Scale Packaging
II-8 Challenges Facing Assembly and Packaging II-8 Technology Trends II-9

4. Growth Drivers II-10 Portable Equipment Drives Growth in Flip Chips II-10
Drivers for Electronic Packaging Technologies II-10 Shrinking Die Sizes to Drive
New Packaging Technologies II-10 Factors Driving Growth in the Chip Scale
Packaging Market II-11 Market Technology Drivers by Major End-Use Sectors II-11

5. Product Overview II-12 Definition II-12 Packaging Hierarchy II-13
Semiconductor Manufacturing Process II-13 IC Supply Chain II-13 Applications of
Electronic Packaging Research II-14 Industrial Applications of Advanced
Packaging and Interconnection II-14 Requirements for Electronic Packaging II-14
Technologies that Facilitate Electronic Packaging II-14 Origin and Evolution
II-14 Electronic Packaging Advances II-15 Semiconductor Packaging - Significance
II-15 Product Segments II-16 Ball Grid Arrays II-17 Types of BGA II-17 Flip Chip
Technology (FCT) II-18 Advantages of Flip-Chip Technology II-18 Flip Chip
Materials & Modeling Infrastructure II-19

Table 9: Trends in Flip Chip Production Worldwide (2000 Vs 2005): Percentage
Breakdown by End Product - Lower Lead Count Products, Non Solder Bumped Die with
TCB, Integrated Passives, Displays/Micro displays, Non Solder Bumped Die with
Conductive Adhesive, High Performance Processors, High Performance Memory, High
Performance ASICS Mid I/O Die, and High Frequency Products (include
corresponding Graphs/Chart) II-20 Multi Chip Modules (MCM) II-20 Advantages of
MCM II-20 Disadvantages of MCM II-21 Module Assembly Techniques II-21 Module
Encapsulation Techniques II-21 Chip Scale Packaging (CSP) II-21 Lead Counts by
Packaging Technology - A Comparison II-22 Wafer-Level Packages II-22 Wire
Bonding II-23 Stacked Die Packages II-23 Die Products II-23 Chip-On-Board (COB)
II-23 Flip-Chip and Wafer-Level Packaging II-23 Adhesive Flip Chip on Flex II-24
Solder Flip-Chip II-24

6. Product Introductions/Innovations II-25 Telit Introduces M2M BGA Module II-25
RJR Polymers Introduces LCP Compatible Epoxies II-25 Five Star Technologies
Launches Advanced Dispersion Products II-25 STATS Complements 3D Technology
Portfolio II-25 Toshiba Develops TSSOP Advance Package II-25 Semtech Expands
MicroClamp Family II-26

7. Recent Industry Activity II-27 TSI Group Acquires Three Los Angeles Based
Brazing and Machining Businesses II-27 Ferro Creates New Electronic Packaging
Materials Unit II-27 A Group of US Based Investors Establish Chip-Packaging
Plant in Vietnam II-27 Blackstone Acquires Klockner II-27 Micronic Gets Another
Asian Customer for FPS5100 Laser Pattern Generator II-27 ASE and Flip Chip in a
Licensing Agreement II-28 Quantum Acquires CiP technology from Silicon Bandwidth
II-28 Sumitomo Acquires Stake in Quantum II-28

8. Focus on Select Players II-29 Advanced Semiconductor Engineering Group
(Taiwan) II-29 ASAT Holdings Limited (Hong Kong) II-29 Amkor Technology Inc.
(US) II-29 ASM International NV (The Netherlands) II-29 ASM Pacific Technology
Ltd (Hong Kong) II-30 CARSEM (Malaysia) II-30 Chipbond Technology Corp (Taiwan)
II-30 ChipMos Technologies (Taiwan) II-30 FlipChip International (US) II-30
Fujitsu Ltd (Japan) II-31 NEC Electronics Corporation (Japan) II-31 Orient
Semiconductor Electronics (Taiwan) II-31 Sliconware Precision Industries Co.,
Ltd. (Taiwan) II-31 STATS ChipPAC Ltd. (Singapore) II-32 Tessera, Inc. (US)
II-32 Toshiba America Electronic Components Inc. (US) II-32 Major Strategies of
Integrated Solution Providers II-32

9. Global Market Perspective II-33

Table 10: World Recent Past, Current & Future Analysis for Advanced Electronic
Packaging by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan), and Rest of World Markets Independently Analyzed with Annual
Revenues in US$ Million for Years 2000 through 2010 (includes corresponding
Graph/Chart) II-33

Table 11: World Long-Term Projections for Advanced Electronic Packaging by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan),
and Rest of World Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2011 through 2015 (includes corresponding Graph/Chart) II-34

Table 12: World 10-Year Perspective for Advanced Electronic Packaging by
Geographic Region - Percentage Breakdown of Dollar Revenues for US, Canada,
Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for
Years 2003, 2008 & 2012 (includes corresponding Graph/Chart) II-35

Table 13: World Recent Past, Current & Future Analysis for Ball Grid Arrays by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan),
and Rest of World Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-36

Table 14: World Long-Term Projections for Ball Grid Arrays by Geographic Region
- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World
Markets Independently Analyzed with Annual Revenues in US$ Million for Years
2011 through 2015 (includes corresponding Graph/Chart) II-37

Table 15: World 10-Year Perspective for Ball Grid Arrays by Geographic Region -
Percentage Breakdown of Dollar Revenues for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2003, 2008 &
2012 (includes corresponding Graph/Chart) II-38

Table 16: World Recent Past, Current & Future Analysis for Chip Scale Packages
by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding
Japan), and Rest of World Markets Independently Analyzed with Annual Revenues in
US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)
II-39

Table 17: World Long-Term Projections for Chip Scale Packages by Geographic
Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of
World Markets Independently Analyzed with Annual Revenues in US$ Million for
Years 2011 through 2015 (includes corresponding Graph/Chart) II-40

Table 18: World 10-Year Perspective for Chip Scale Packages by Geographic Region
- Percentage Breakdown of Dollar Revenues for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2003, 2008 &
2012 (includes corresponding Graph/Chart) II-41

Table 19: World Recent Past, Current & Future Analysis for Multi Chip Modules by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan),
and Rest of World Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 II-42

Table 20: World Long-Term Projections for Multi Chip Modules by Geographic
Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of
World Markets Independently Analyzed with Annual Revenues in US$ Million for
Years 2011 through 2015 (includes corresponding Graph/Chart) II-43

Table 21: World 10-Year Perspective for Multi Chip Modules by Geographic Region
- Percentage Breakdown of Dollar Revenues for US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2003, 2008 &
2012 (includes corresponding Graph/Chart) II-44

III. MARKET

1. The United States III-1 A.Market Analysis III-1 Outlook III-1 Chip
Manufacturers - Looking for Greener Pastures III-1 Key US Players III-1 Product
Launches III-2 Strategic Developments III-3 B.Market Analytics III-4

Table 22: US Recent Past, Current & Future Analysis for Advanced Electronic
Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi
Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding Graph/Chart) III-4

Table 23: US Long-Term Projections for Advanced Electronic Packaging by Product
Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million for Years 2011
through 2015 (includes corresponding Graph/Chart) III-5

Table 24: US 10-Year Perspective for Advanced Electronic Packaging by Product
Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-5

2. Canada III-6 A.Market Analysis III-6 Outlook III-6 B.Market Analytics III-6

Table 25: Canadian Recent Past, Current & Future Analysis for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in
US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)
III-6

Table 26: Canadian Long-Term Projections for Advanced Electronic Packaging by
Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$ Million for Years
2011 through 2015 (includes corresponding Graph/Chart) III-7

Table 27: Canadian 10-Year Perspective for Advanced Electronic Packaging by
Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-7

3. Japan III-8 A.Market Analysis III-8 Outlook III-8 Weakness in the Industry
Structure III-8 Japanese Companies on Comeback Trial III-8 Select Players III-9
B.Market Analytics III-10

Table 28: Japanese Recent Past, Current & Future Analysis for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in
US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)
III-10

Table 29: Japanese Long-Term Projections for Advanced Electronic Packaging by
Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$ Million for Years
2011 through 2015 (includes corresponding Graph/Chart) III-10

Table 30: Japanese 10-Year Perspective for Advanced Electronic Packaging by
Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-11

4. Europe III-12 A.Market Analysis III-12 European Advanced Packaging
Technologies III-12 B.Market Analytics III-13

Table 31: European Recent Past, Current & Future Analysis for Advanced
Electronic Packaging by Geographic Region - France, Germany, Italy, UK, and Rest
of Europe Markets Analyzed with Annual Revenues in US$ Million for Years 2000
through 2010 (includes corresponding Graph/Chart) III-13

Table 32: European Long-Term Projections for Advanced Electronic Packaging by
Geographic Region - France, Germany, Italy, UK, and Rest of Europe Markets
Analyzed with Annual Revenues in US$ Million for Years 2011 through 2015
(includes corresponding Graph/Chart) III-14

Table 33: European 10-Year Perspective for Advanced Electronic Packaging by
Geographic Region - Percentage Breakdown of Dollar Revenues for France, Germany,
Italy, UK, and Rest of Europe Markets for Years 2003, 2008 & 2012 (includes
corresponding Graph/Chart) III-15

Table 34: European Recent Past, Current & Future Analysis for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in
US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)
III-16

Table 35: European Long-Term Projections for Advanced Electronic Packaging by
Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$ Million for Years
2011 through 2015 (includes corresponding Graph/Chart) III-16

Table 36: European 10-Year Perspective for Advanced Electronic Packaging by
Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-17

4a. France III-18 Market Analysis III-18

Table 37: French Recent Past, Current & Future Analysis for Advanced Electronic
Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi
Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding Graph/Chart) III-18

Table 38: French Long-Term Projections for Advanced Electronic Packaging by
Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$ Million for Years
2011 through 2015 (includes corresponding Graph/Chart) III-19

Table 39: French 10-Year Perspective for Advanced Electronic Packaging by
Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-19

4b. Germany III-20 A.Market Analysis III-20 Outlook III-20 B.Market Analytics
III-20

Table 40: German Recent Past, Current & Future Analysis for Advanced Electronic
Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi
Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding Graph/Chart) III-20

Table 41: German Long-Term Projections for Advanced Electronic Packaging by
Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$ Million for Years
2011 through 2015 (includes corresponding Graph/Chart) III-21

Table 42: German 10-Year Perspective for Advanced Electronic Packaging by
Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-21

4c. Italy III-22 Market Analysis III-22

Table 43: Italian Recent Past, Current & Future Analysis for Advanced Electronic
Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi
Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding Graph/Chart) III-22

Table 44: Italian Long-Term Projections for Advanced Electronic Packaging by
Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$ Million for Years
2011 through 2015 (includes corresponding Graph/Chart) III-23

Table 45: Italian 10-Year Perspective for Advanced Electronic Packaging by
Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-23

4d. The United Kingdom III-24 Market Analysis III-24

Table 46: UK Recent Past, Current & Future Analysis for Advanced Electronic
Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi
Chip Modules Markets Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding Graph/Chart) III-24

Table 47: UK Long-Term Projections for Advanced Electronic Packaging by Product
Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million for Years 2011
through 2015 (includes corresponding Graph/Chart) III-25

Table 48: UK 10-Year Perspective for Advanced Electronic Packaging by Product
Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-25

4e. Rest of Europe III-26 A.Market Analysis III-26 Outlook III-26 Strategic
Development III-26 Key Player III-26 ASM International NV (The Netherlands)
III-26 B.Market Analytics III-27

Table 49: Rest of Europe Recent Past, Current & Future Analysis for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in
US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)
III-27

Table 50: Rest of Europe Long-Term Projections for Advanced Electronic Packaging
by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip
Modules Markets Independently Analyzed with Annual Revenues in US$ Million for
Years 2011 through 2015 (includes corresponding Graph/Chart) III-28

Table 51: Rest of Europe 10-Year Perspective for Advanced Electronic Packaging
by Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid
Arrays, Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008
& 2012 (includes corresponding Graph/Chart) III-28

5. Asia-Pacific III-29 A.Market Analysis III-29 Outlook III-29 A Brief Review
III-29 China - A Promising Market III-29 Taiwan - Looking Ahead III-29 Product
Launch III-30 Strategic Developments III-30 Key Players III-30 Advanced
Semiconductor Engineering Group (Taiwan) III-30 ASAT Holdings Limited (Hong
Kong) III-31 STATS ChipPAC Ltd (Singapore) III-31 ASM Pacific Technology Ltd.
(Hong Kong) III-31 CARSEM (Malaysia) III-31 Chipbond Technology Corp (Taiwan)
III-31 ChipMos Technologies (Taiwan) III-31 Orient Semiconductor Electronics
(Taiwan) III-32 Siliconware Precision Industries Co., Ltd. (Taiwan) III-32 STATS
ChipPAC Ltd (Singapore) III-32 B.Market Analytics III-33

Table 52: Asia-Pacific Recent Past, Current & Future Analysis for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets Independently Analyzed with Annual Revenues in
US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart)
III-33

Table 53: Asia-Pacific Long-Term Projections for Advanced Electronic Packaging
by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip
Modules Markets Independently Analyzed with Annual Revenues in US$ Million for
Years 2011 through 2015 (includes corresponding Graph/Chart) III-34

Table 54: Asia-Pacific 10-Year Perspective for Advanced Electronic Packaging by
Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-34

6. Rest of World III-35 Market Analysis III-35

Table 55: Rest of World Recent Past, Current & Future Analysis for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets Independently Analyzed with Annual Revenuesin US$
Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-35

Table 56: Rest of World Long-Term Projections for Advanced Electronic Packaging
by Product Segment - Ball Grid Arrays, Chip Scale Packages, and Multi Chip
Modules Markets Independently Analyzed with Annual Revenues in US$ Million for
Years 2011 through 2015 (includes corresponding Graph/Chart) III-36

Table 57: Rest of World 10-Year Perspective for Advanced Electronic Packaging by
Product Segment - Percentage Breakdown of Dollar Revenues for Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-36

IV. COMPETITIVE LANDSCAPE

-Aavid Thermalloy LLC (USA) -Advanced Interconnect Technologies (Singapore)
-Advanced Semiconductor Engineering Group (Taiwan) -Amkor Technology, Inc (USA)
-Analog Devices, Inc (USA)-Asat Holdings Limited (Hong Kong) -ASM International
NV (The Netherlands) -Atmel Corporation (USA) -California Micro Devices
Corporation (USA) -Carsem (M) Sdn Bhd (Malaysia) -Chipscale, Inc (USA) -Datacon
Semiconductor Equipment GmbH (Austria) -Dupont Electronic Technologies (USA)
-Fairchild Semiconductor International, Inc (USA) -Flextronics Semiconductor
(USA) -Flip chip International LLC (USA) -Fujitsu Limited (Japan) -Global
Advanced Packaging Technology Ltd (China) -Globetronics Technology Bhd
(Malaysia) -Hitachi Ltd (Japan) -Hynix Semiconductor, Inc (Korea) -Ibiden
Circuits Of America Corporation (USA) -Infineon Technologies AG (Germany)
-Integrated Device Technology, Inc (USA) -Intel Corporation (USA) -Interconnect
Systems, Inc (USA) -Interpoint Corporation (USA) -Intersil Corporation (USA)
-Ironwood Electronics, Inc (USA) -Kingpak Technology, Inc (USA) -Royal Philips
Electronics NV (The Netherlands) -Kyocera America, Inc (USA) -Lattice
Semiconductor Corporation (USA) -LG Electronics (South Korea) -LSI Logic
Corporation (USA) -Maxtek Components Corporation (USA) -Micron Technology, Inc
(USA) -Micronic Laser Systems AB (Sweden) -Microsemi Corporation (USA)
-Mitsubishi Electric and Electronics USA, Inc (USA) -Mitsui High-Tec, Inc
(Japan) -Motorola, Inc (USA) -M-Systems Flash Disk Pioneers Ltd (Israel)
-National Semiconductor Corporation (USA) -NEC Electronics Corporation (Japan)
-NemeriX SA (Switzerland) -NTK Technologies, Inc (USA) -Ohmite Manufacturing Co
(USA) -OKI Semiconductor Company (USA) -Orient Semiconductor Electronics Ltd
(Taiwan) -Pantronix Corporation (USA) -Parelec, Inc (USA) -Philips
Semiconductors (The Netherlands) -Phoenix Precision Technology Corporation
(Taiwan) -Polymer Assembly Technology, Inc (USA) -Samsung Electro-Mechanics Co,
Ltd (South Korea) -Sanmina-SCI Corporation (USA) -Semtech Corporation (USA)
-Sharp Microelectronics of the Americas (USA) -Shellcase Limited (Israel)
-Shinko Electric Co, Ltd (Japan) -Silicon Storage Technology (USA) -Siliconware
Precision Industries Co, Ltd (Taiwan) -Skyworks Solutions, Inc (USA) -ST
Assembly Test Services (Singapore) -ST Microelectronics, Inc (USA) -Stats
Chippac, Ltd (Singapore) -TDA Systems, Inc (USA) -Tessera Technologies, Inc
(USA) -Texas Instruments, Inc (USA) -Toshiba America Electronic Components, Inc
(USA) -Traquair Data System, Inc (USA) -Unimicron Corporation (Taiwan) -Unitive,
Inc (USA) -White Electronic Designs Corporation (USA) -WJ Communications, Inc
(USA) -Yamaichi Electronics USA, Inc (USA)

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