Rambus Acquires Inapac Patents

System-in-Package Innovations Broaden Solutions for Mobile Memory
LOS ALTOS, Calif.--(Business Wire)--
Rambus Inc. (NASDAQ:RMBS), one of the world's premier technology licensing
companies specializing in high-speed memory architectures, today announced it
has acquired a number of patents from Inapac Technology, Inc. to broaden its
offerings for the mobile memory market. These patented innovations complement
the high-bandwidth, low-power memory technologies developed by Rambus as part of
its Mobile Memory Initiative, announced earlier this year. Specific terms of the
deal are not disclosed.

These newly acquired patented innovations are key enablers for achieving high
manufacturing yields in System-in-Package (SiP) implementations. SiP consists of
a number of stacked integrated circuits (IC) - such as a media processor, DRAM,
and Flash memory device - enclosed in a single package or module. This
technology allows designers to achieve high functionality in a very compact
space, ideal for mobile products such as mobile phones and mobile gaming
devices. Given its performance characteristics, SiP has applicability in
computing and consumer electronics products as well.

"These patented innovations, which have been proven in shipments in over 90M
DRAM devices in SiP implementations, broaden our portfolio for the mobile
market," said Herb Gebhart, vice president of Strategic Development at Rambus.
"Combined with our high-performance, power-efficient memory technology, we offer
compelling solutions that will help our licensees develop a new generation of
breakthrough mobile products."

Known to the industry as SiPFLOW, the acquired patented innovations greatly
increase the assembly yield in SiP devices. Industry-leading reliability rates
of less than 100 defective parts per million (DPPM) have been achieved in
high-volume SiP containing a DRAM and media processor. Products including the
Motorola RAZR V3i and the Sony Ericsson C902 mobile phones have used these
patented innovations through separate technology license agreements with Inapac.

Rambus` Mobile Memory Initiative focuses on the development of high-performance,
low-power memory solutions for smartphones, netbooks, portable gaming, and
portable multimedia products. Rambus has demonstrated in silicon data rates of
4.3Gbps at best-in-class power efficiency. With this performance, designers
could realize more than 17Gigabytes per second of memory bandwidth from a single
mobile DRAM device.

For more information on Rambus` Mobile Memory Initiative, please visit
www.rambus.com/mobile.

About Rambus Inc.

Rambus is one of the world's premier technology licensing companies specializing
in the invention and design of high-speed memory architectures. Since its
founding in 1990, the Company's patented innovations, breakthrough technologies
and renowned integration expertise have helped industry-leading chip and system
companies bring superior products to market. Rambus' technology and products
solve customers' most complex chip and system-level interface challenges
enabling unprecedented performance in computing, communications and consumer
electronics applications. Rambus licenses both its world-class patent portfolio
as well as its family of leadership and industry-standard interface products.
Headquartered in Los Altos, California, Rambus has regional offices in North
Carolina, India, Germany, Japan, and Taiwan. Additional information is available
at www.rambus.com.

Rambus has issued and/or pending patent applications relevant to technologies
discussed in this press release.

Rambus Public Relations
Linda Ashmore, 650-947-5411
lashmore@rambus.com

Copyright Business Wire 2009