KLA-Tencor Introduces TeraScanXR: Extending the Industry`s Only All-Plane Reticle Inspection Platform to the 32nm Node

MILPITAS, Calif.--(Business Wire)--
Today, KLA-Tencor Corporation (NASDAQ:KLAC) introduced the TeraScanXR, bringing
high-resolution reticle-, aerial- and wafer-plane inspection capability to the
32nm node. This new tool, an extension of existing TeraScan reticle inspection
systems, is designed to provide mask manufacturers better sensitivity, lower
cost-per-inspection and faster mask dispositioning. In addition, the TeraScanXR
is the only reticle inspection tool on the market to supply the complete set of
inspection planes: high resolution reticle-plane inspection (RPI) to capture
process defects during development and manufacturing; aerial-plane inspection
(API) to filter out certain non-printing defects; and wafer-plane inspection
(WPI) to predict which reticle defects will print on the wafer.

"Eliminating printable defects in the manufacturing of 32nm-node mask sets
requires an inspection tool with multiple capabilities," commented Brian Haas,
vice president and general manager of the Reticle and Photomask Inspection
Division at KLA-Tencor. "Mask makers need flexible, high productivity, high
sensitivity inspection to capture all defects necessary for process development
and control. They also need to know which of these defects will print on a
wafer, so they can focus on repairing and verifying only the printable
defects-and get their mask sets shipped more rapidly. Only KLA-Tencor sells a
reticle inspection system with both high resolution and the ability to assess
defect printability. We`re offering this system as a new tool or as an upgrade
to our widely installed TeraScan product line, to ensure mask shops can make the
most efficient use of their capital."

The TeraScanXR reticle inspection system features changes to the optics,
electronics, algorithms and computer which improve overall sensitivity to meet
32nm requirements. Nuisance detections, such as defects arising from variations
on assist structures, can be minimized without sacrificing sensitivity. A
substantial throughput improvement makes TeraScanXR up to three times the speed
of its predecessor, TeraScanHR, resulting in lower cost-per-inspection and
enabling a mask set to be shipped to the fab in a shorter time.

In addition to being the only all-plane inspection platform, TeraScan is the
only reticle inspection platform designed to accurately predict defect
printability-regardless of pattern density. API, as implemented on TeraScanXR
and other inspection tools, reduces certain types of `nuisance` defects, but
TeraScan`s WPI is needed to properly determine the printability of defects
within dense patterns. Diffraction effects cause these defects to be magnified
more than their counterparts in sparsely patterned areas.

Strong interest in the TeraScanXR system has resulted in several orders from the
leading merchant and captive mask manufacturers in Asia and the United States.
As an upgrade on the industry-standard TeraScan platform, which boasts multiple
installations in every major mask shop worldwide, TeraScanXR offers the most
cost-effective means to attain 32nm sensitivity for all reticle inspection
applications.

About KLA-Tencor: KLA-Tencor Corporation is the world`s leading supplier of
process control and yield management solutions for the semiconductor and related
microelectronics industries. Headquartered in Milpitas, Calif., the company has
sales and service offices around the world. An S&P 500 company, KLA-Tencor is
traded on the NASDAQ Global Select Market under the symbol KLAC. Additional
information about the company is available at http://www.kla-tencor.com
(KLAC-P).

KLA-Tencor Corporation
Ed Lockwood, 408-875-9529 (Investor Relations)
Sr. Director, Investor Relations
ed.lockwood@kla-tencor.com
Meggan Powers, 408-875-8733 (Media Relations)
Sr. Director, Corporate Communications
meggan.powers@kla-tencor.com

Copyright Business Wire 2009