Wire Bonding Company Palomar Technologies to Exhibit at 2009 SMT Nuremberg

CARLSBAD, CA, Apr 29 (MARKET WIRE) --
Palomar Technologies, a world leader in providing solutions for
microelectronic and optoelectronic packaging, and experts in precision
wire bonding, gold wire bonding, and high accuracy component placement
systems, announced today that it will exhibit at SMT Nuremberg from May 5
through 7.

Palomar's Model 8000 Wire Bonder / Ball Bonder is uniquely suited to yield
high reliability low profile interconnects. Using its patented ball bump
process, ball bumps can be precisely placed on LED die pads. Typically,
the next step is to complete a reverse bond where the stitch bond is
attached to the bump. This process is commonly referred to as a Stand-off
Stitch and enables greater light output from each LED. Using this
process, Palomar Technologies has been able to reliably hold loop heights
below 100um with wire sizes up to 38um diameter. In addition to low
profile loops, a key benefit is increased joint strength as evidenced by
virtually 100% mid-wire breaks during destructive pull test.

Palomar Microelectronics, the development, test, and contract assembly
division of Palomar Technologies has seen rapid growth in the last 18
months in applications requiring high process expertise. Palomar
Microelectronics assembly services include advanced wire bonding, gold
stud bumping, eutectic die attach, active optical cable packaging, power
amplifier assembly, solar cell assembly, wafer scale packaging, precision
component placement for high-power LEDs, MEMS, microwave/RF, multichip
modules (MCMs), hybrid microcircuits and device bonding for GGI processes.

Recently, Palomar formed alliances with 3 system manufacturers to offer
customers worldwide the most complete first-level interconnect solutions
available. The alliance companies' systems include Precision Fluid
Dispensers, Bond Testing and Die Sorters, and Manual Wire Bonding and Die
Bonders to complement Palomar's automatic assembly systems.

About Palomar Technologies

Palomar Technologies, formerly part of Hughes Aircraft, is the world's
foremost provider of high-precision wire bonders, gold wire bonders, die
bonders and automated component placement systems. Palomar combines
process development and contract assembly services to increase yield and
lower costs for microelectronic device manufacturers in the
telecommunications, medical, defense and aerospace and commercial high
technology industries. Find Palomar on the web at
www.palomartechnologies.com.

Contact:
Josef Schmidl
Palomar Technologies GmbH
Phone: 49-9131-48009-30
Fax: 49-9131-48009-55
Email Contact

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