Rudolph Announces New MetaPULSE-G Copper Film Metrology System

Latest PULSE Technology offers complete copper process control solution for
advanced technology nodes and emerging TSV applications
FLANDERS, N.J.--(Business Wire)--
Rudolph Technologies, Inc. (Nasdaq: RTEC), a worldwide leader in process
characterization solutions for the semiconductor manufacturing industry,
announced today the availability of its new MetaPULSE®-G thin film measurement
tool optimized specifically for copper damascene processes at 45nm through 22nm
technology nodes and copper via fill in new 3D IC applications. Copper thickness
and overburden measurements are critical in optimizing the CMP process that
follows deposition during through-silicon via (TSV) manufacturing. The new tool
measures 60-80 product wafers per hour with gauge-capable precision and reduced
cost of ownership. Rudolph is accepting orders now with initial shipments
planned for the fourth quarter of 2009.

"Our MetaPULSE line is the industry standard for thickness measurements on
opaque films," commented Jack Kurdock, Rudolph`s vice president and general
manager of the Metrology Business Unit. "The MetaPULSE-G reinforces that
position with superior performance on the copper films that are critical in
today`s advanced device technologies and new TSV processes. The MetaPULSE has a
ten micron spot size that is fully capable of measuring films within advanced
test sites and in the active die on product wafers at throughputs that can
support high-volume production. Most important, and unlike optical and x-ray
techniques, the MetaPULSE measures film thickness using a time-resolved acoustic
signal that can be used in active die in the absence of special underlying test
pads."

The high-reliability, green wavelength ultrafast laser used in the MetaPULSE-G
is optimized for copper applications, delivering higher signal-to-noise ratios
and measurement repeatability better than 0.3 percent at throughputs of 60-80
WPH. The system`s 10um X 10um spot size is small enough to assure measurement
capability on product wafers in 30x30um or smaller test sites.

A TSV 3D package (3D IC) contains two or more chips stacked vertically, with
vias through the silicon substrates replacing edge wiring to create an
electrical connection between the circuit elements on each chip. TSV technology
provides a dramatic increase in the functionality of the device in a very small
footprint. Multiple technologies are being explored to form vias during the
wafer fabrication process (front-end) and the IC packaging and assembly stage
(back-end). Metrology and inspection of the TSVs are critical for ensuring the
performance of the 3D ICs and the profitability of the overall manufacturing
process.

Rudolph Technologies is a worldwide leader in the design, development,
manufacture and support of high-performance process control metrology, defect
inspection and data analysis systems used by semiconductor device manufacturers.
Rudolph provides a full-fab solution through its families of proprietary
products that provide critical yield-enhancing information, enabling
microelectronic device manufacturers to drive down costs and time to market. The
company has enhanced the competitiveness of its products in the marketplace by
anticipating and addressing many emerging trends driving the semiconductor
industry's growth. Rudolph`s strategy for continued technological and market
leadership includes aggressive research and development of complementary
metrology and inspection solutions. Headquartered in Flanders, New Jersey,
Rudolph supports its customers with a worldwide sales and service organization.
Additional information can be found on the company`s web site at
www.rudolphtech.com.

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of the
Private Securities Litigation Reform Act of 1995 (the "Act"). In some cases, you
can identify those so-called "forward-looking statements" by words such as
"may," "will," "would," "should," "expects," "plans," "anticipates," "believes,"
"feels," "estimates," "predicts," "potential," or "continue," or the negative of
those words and other comparable words. Rudolph wishes to take advantage of the
"safe harbor" provided for by the Act and cautions that actual results may
differ materially from those projected as a result of various factors, including
risks and uncertainties, many of which are beyond Rudolph`s control. Factors
that could cause actual results to differ materially from the expectations
expressed in such forward-looking statements, include, but are not limited to,
the impact of the slowdown in the overall economy, the uncertainty of the
current global political environment, the potential for terrorist attacks, the
potential for business disruptions due to infectious diseases, changes in
customer demands for our existing and new products, the timing, cancellation or
delay of customer orders and shipments, the timing of revenue recognition of
shipments, new product offerings from our competitors, changes in or an
inability to execute Rudolph`s business strategy, unanticipated manufacturing or
supply problems and changes in tax rules. Rudolph cannot guarantee future
results, levels of activity, performance, or achievements. The matters discussed
in this press release also involve risks and uncertainties as summarized in
Rudolph`s Form 10-K report for the year ended December 31, 2008 and other
filings with the Securities and Exchange Commission ("SEC"), which are available
at http://www.sec.gov, the SEC`s website, and at http://www.rudolphtech.com, the
Rudolph website. While these factors may be updated from time to time through
the filing of reports and registration statements with the SEC, Rudolph does not
assume any obligation to update the forward-looking information contained in
this press release.

Rudolph Technologies, Inc.
Investors:
Steven R. Roth, 973-448-4302
steven.roth@rudolphtech.com
or
Trade Press:
Virginia Becker, 952-259-1647
virginia.becker@rudolphtech.com

Copyright Business Wire 2009