eSilicon Sponsors GSA & IET International Semiconductor Forum; Hosts VIP Dinner

SUNNYVALE, CA, May 18 (MARKET WIRE) --

WHAT: eSilicon Corporation will be a Platinum Plus sponsor for the 6th
annual GSA & IET International Semiconductor Forum. At the gathering of
European electronics and semiconductor leaders, the pioneering value chain
producer (VCP) will showcase its innovative outsourcing approach for
reducing cost, risk and time in developing custom chip solutions. Company
CEO and President Jack Harding will also be the host for a VIP Dinner for
attendees on the opening evening of the event.

The 2009 Forum is focused on leveraging and maximizing European expertise
in analog/mixed-signal, wireless and MEMS applications, as well as
addressing the markets for ASICs and multi-die packaging trends. The forum
will feature a town hall discussion on the future of the emerging company
semiconductor business model and its impact on sourcing innovation.

For more information about the conference, please go
to:
http://www.gsaietsemiconductorforum.com/

WHEN: June 2-3, 2009

WHERE: Hotel Bayerischer Hof
Promenadeplatz 2-6
80333 Munich, Germany
www.bayerischerhof.de

WHO: eSilicon, a leading Value Chain Producer (VCP) for the
semiconductor industry, provides a comprehensive suite of design,
productization and manufacturing services, enabling a flexible, low-cost,
lower-risk path to volume chip production. The company delivers custom
chips (ASICs) to system OEMs and fabless semiconductor companies who
serve a wide variety of markets including the consumer, computer,
communications and industrial segments. For more information, please go
to www.esilicon.com.

eSilicon and the eSilicon logo are registered trademarks of eSilicon
Corporation.

For more information, please contact:

Patrick Soheili
eSilicon Corporation
psoheili@esilicon.com
408-616-4629

Mike Sottak
Wired Island, Ltd.
mike@wiredislandpr.com
408-876-4418

Copyright 2009, Market Wire, All rights reserved.

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