S3 and Percello Collaborate to Produce Latest Femtocell Baseband Processor

MUNICH, Germany--(Business Wire)--
Silicon & Software Ltd.(S3), a worldwide leading provider of semiconductor chip
design services, today announced that they completed all of the Integrated
Circuit(IC) implementation for Percello`s latest PRC6000 chipset. Percello, a
UMTS/LTE femtocell SoC vendor, produce femtocell baseband processors and chose
S3 because of their proven expertise and experience in delivering
first-time-right designs. PRC6000 is the first worldwide SoC solution dedicated
for the emerging 3G UMTS and HSPA+ femtocell market. As part of the
collaboration S3 seamlessly dealt with all of the complex issues associated with
very deep sub-micron SoC design such as 65nm, clock distribution, DDR2 and
handoff to the foundry.

A femtocell is a small cellular base station, typically designed for use in
residential or small business environments. The femtocell incorporates the
functionality of a typical base station but extends it to allow a simpler, self
contained deployment; an example is a UMTS femtocell containing a Node B and RNC
with Ethernet for backhaul. Percello`s PRC6000 chip is a highly integrated
device supporting all femtocell backhauling architectures and functions such as
timing, security and others. PRC6000 is compliant to 3GPP HNB Rel-8 baseline, it
supports 8 users simultaneously and is capable of delivering 21.6Mbps downlink
and 5.76 Mbps uplink.

"Achieving a first-pass silicon success on such a highly complex SoC
necessitates high expertise and special skills during the backend phase. S3
proved to be the perfect partner for taping out the PRC6000 in TSMC's 65nm
CMOS." said Rafy Carmon, Vice President of R&D at Percello Ltd. "S3 committed to
Percello's aggressive schedule and low-power low-cost silicon goals. We are very
pleased with the cooperation and collaboration between the engineering teams
which facilitated our very fast design cycle."

"Percello`s PRC6000 is the most advanced chipset for femtocell basebands
currently available. S3 is proud to have been able to deliver the IC
implementation first-time-right and ahead of schedule to enable Percello to get
to market faster and continue to grow," said James Blair, Director of, Consumer
Silicon Services. "With a strong focus on performance and low power S3 offered
Percello a one-stop shop solution to address all of their needs around this
complex SoC design."

-Ends-

About Silicon & Software Systems Ltd. (S3):

S3 is the Connected Consumer Technology Company, providing semiconductor design
services, semiconductor IP, software products, systems knowledge expertise for
its global client base competing in fast-moving consumer electronics as well as
wired and wireless communications markets. S3`s technologies, products and
professional services enable semiconductor companies, consumer electronics
companies and healthcare providers to deliver next-generation devices, systems
and services to consumers at home and on the move. For IC designers and product
managers, S3 delivers a comprehensive portfolio of mixed-signal IP and design
services for power-efficient single-chip systems. S3`s System-on-Chip customers
are repeat users, who benefit from having the confidence to meet tight
time-to-market schedules with reduced design risk. S3`s mixed signal IP includes
a wide portfolio of high performance A/D and D/A convertors, PLLs, Analog Front
Ends (AFEs) and other miscellaneous circuits which have been silicon proven at a
number of merchant foundries (TSMC, UMC, Chartered, IBM, Tower, SMIC) at nodes
ranging from 0.18um to 65nm.

Founded in 1986, S3 has design centers in Ireland (Dublin and Cork), Lisbon in
Portugal, Wroclaw in Poland, Prague in the Czech Republic and San Jose in the
USA with sales offices and representatives globally. For further information
please visit www.s3group.com or email us at info@s3group.com

About Percello

Percello, a fabless semiconductor company, was founded to provide digital
baseband solutions to the challenges of the 3G/HSDPA/HSUPA/HSPA+/LTE femtocells
market: cost, power, level of integration, development time and flexibility.

Percello team has vast knowledge in silicon design, software and
3G/HSDPA/HSUPA/HSPA+/LTE communication systems. The team has proven capability
to deliver complicated SoC from standard to mass production.

Percello's architecture combines programmable multi processing DSPs and
dedicated HW accelerators. This approach is optimized for power consumption,
cost reduction and risk minimization. For more information about Percello,
please visit www.percello.com.

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All trademarks contained herein (whether registered or not) and all associated
rights are recognized.

Silicon & Software Systems (S3)
Fiona D`Arcy, Corporate Communications Director,
Tel: +353.87.2808828
Email: fiona.darcy@s3group.com

Copyright Business Wire 2009