Tessera to Present on Advanced Flip Chip Packaging at ECTC

SAN JOSE, Calif.--(Business Wire)--
Tessera Technologies, Inc. (Nasdaq:TSRA) will be featured in a session on
Advanced Flip Chip Packaging at the Electronic Components and Technology
Conference (ECTC). Ilyas Mohammed, director of package development for Tessera`s
Micro-electronics group, will give a presentation on the Reliability of
Fine-Pitch Flip Chip Packages.

WHEN: Session 7
May 27, 2009, at 1:55 p.m.

WHERE: ECTC
Sheraton San Diego Hotel & Marina
San Diego, California

About Tessera

Tessera Technologies develops and delivers technologies for wireless, consumer
and computing products. The company`s packaging and interconnect solutions
enable smaller, higher-functionality electronic devices. Tessera`s imaging and
optics solutions provide low-cost, high-quality camera functionality in
electronic products and include image sensor packaging, wafer-level optics and
image enhancement intellectual property. The company also offers customized
micro-optic lenses, from diffractive and refractive optical elements to
integrated micro-optical subassemblies. Tessera licenses its technologies, as
well as delivers products based on these technologies, to promote the
development of the supply chain infrastructure. The company is headquartered in
San Jose, California. For information call 1.408.321.6000 or go to
www.tessera.com.

Tessera and the Tessera logo are trademarks or registered trademarks of Tessera,
Inc. or its affiliated companies in the United States and other countries. All
other company, brand and product names may be trademarks or registered
trademarks of their respective companies.

Tessera
Judy Erkanat, +1-408-321-6751
jerkanat@tessera.com
or
LEWIS PR for Tessera
Catherine Koo / Nicole Wasowski, +1-415-992-4400
Tessera@lewispr.com

Copyright Business Wire 2009