TSMC Launches Unified Interconnect Modeling Format for Advanced Process Technologies

TSMC Launches Unified Interconnect Modeling Format for Advanced Process
Technologies

New iRCX Format Ensure Data Accuracy and Enables Extensive EDA Support of
Interconnect Modeling Related Applications in TSMC 65nm and 40nm

HSINCHU, Taiwan, May 27 /PRNewswire-FirstCall/ -- Taiwan Semiconductor
Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today unveiled iRCX, an
interoperable electronic design automation (EDA) data format, for TSMC 65
nanometer (nm) and 40nm technologies.

iRCX format unifies interconnect modeling data delivery, ensures data
integrity and interpretation. EDA tools which support iRCX format will be able
to receive accurate interconnect modeling data from the iRCX files developed
and supported by TSMC. Interconnect related EDA applications, including place
& route, RC extraction, electromigration analysis, power integrity analysis,
and electromagnetic simulation are to benefit from iRCX. iRCX is the first of
several interoperable EDA interface formats co-developed between TSMC and its
design tool partners as part of the TSMC Open Innovation Platform(TM) (OIP).

Interconnect modeling data is getting more important as chip designs in
advanced technologies require detailed views of the parasitic effects for
accurate evaluation of chip performance and power consumption. TSMC
collaborates extensively with EDA ecosystem partners in the iRCX initiative,
defines the unified format based on TSMC process requirements, works with EDA
partners to implement the new format support in the tools, and closes the loop
by qualifying tool accuracy against actual silicon measurements, eliminating
data inconsistency, reducing customer tool evaluation time and improving
design accuracy. The qualification result is to be found in TSMC EDA
qualification program on TSMC-Online, the company's customer portal. Multiple
EDA companies are participating in the qualification program.

"TSMC is the first foundry to collaborate with multiple EDA vendors to create
and qualify an interoperable interconnect modeling format that optimizes data
delivery and interpretation between interconnect extraction, modeling and
analysis tools and advanced process technologies," said Shauh-Teh Juang,
senior director, Design Infrastructure Marketing at TSMC. "iRCX is part of the
TSMC Open Innovation Platform that includes the Active Accuracy Assurance
Initiative. This new unified EDA data format provides designers the ability to
select qualified EDA tools to match their design needs, improve compliance
with TSMC processes, and ensure design accuracy for first time silicon
success."

About TSMC Active Accuracy Assurance Initiative (AAA)
TSMC's AAA initiative is a broad-based program that encompasses all design
ecosystem components. It provides accurate standards for all TSMC partners,
EDA vendors, IP providers, library developers, and Design Center Alliance
(DCA) members. The standards apply to tools, building blocks, and
technologies, including TSMC Reference Flow 9.0, design for manufacturing
(DFM) tools, process design kits (PDK), design support and backend services.

About TSMC Open Innovation Platform
The TSMC Open Innovation Platform promotes timeliness-driven innovation
amongst the semiconductor design community, its ecosystem partners and TSMC's
IP, design implementation and DFM capabilities, process technology and backend
services. The Open Innovation Platform(TM) includes a set of ecosystem
interfaces and collaborative components initiated and supported by TSMC that
efficiently empowers innovation throughout the supply chain and enables the
creation and sharing of newly created revenue and profitability. TSMC's AAA
initiative is a critical part of the Open Innovation Platform(TM), providing
the accuracy and quality required by ecosystem interfaces and collaborative
components.

About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing the
industry's leading process technology and the foundry's largest portfolio of
process-proven libraries, IP, design tools and reference flows. The Company's
total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers,
including capacity from two advanced 12-inch - GigaFabs(TM), four eight-inch
fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech
and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry
to provide 40nm production capabilities. Its corporate headquarters are in
Hsinchu, Taiwan. For more information about TSMC please visit
http://www.tsmc.com.

SOURCE Taiwan Semiconductor Manufacturing Company, Ltd.

Wendy Matthews of Taiwan Semiconductor Manufacturing Company, Ltd.,
+1-408-382-8030, wmatthews@tsmc.com