RadiSys to Present at the RBC Capital Markets` 2009 Technology, Media and Communications Conference on June 9, 2009

HILLSBORO, Ore.--(Business Wire)--
RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of advanced
embedded solutions, announced that it will participate in the RBC Capital
Markets` 2009 Technology, Media and Communications Conference to be held June
9-10, 2009 in San Francisco, CA. Brian Bronson, RadiSys Chief Financial Officer,
will present an overview of the Company`s business and strategy on Tuesday, June
9, 2009 at 9 a.m. PT.

A live audio webcast and a replay of the event will be available on the
Company`s investor relations website at http://investor.radisys.com/.

About RadiSys

RadiSys (NASDAQ: RSYS) is a leading provider of advanced embedded solutions for
the communications networking and commercial systems markets. Through intimate
customer collaboration and combining innovative technologies and
industry-leading architecture, RadiSys helps OEMs, systems integrators and
solution providers bring better products to market faster and more economically.
RadiSys products include embedded boards, application enabling platforms and
turn-key systems, which are used in today`s complex computing, processing and
network intensive applications. For more information, visit
http://www.radisys.com, write to info@radisys.com, or call 800-950-0044 or
503-615-1100. Editors seeking more information may contact Lyn Pangares at
RadiSys Corporation at 503-615-1220 or lyn.pangares@radisys.com.

RadiSys is a registered trademark of RadiSys Corporation.

RadiSys Corporation
Chief Financial Officer
Brian Bronson, 1-503-615-1281
brian.bronson@radisys.com
or
Finance and Investor Relations Manager
Holly Stephens, 1-503-615-1321
holly.stephens@radisys.com

Copyright Business Wire 2009