austriamicrosystems Introduces Advanced Through Silicon Via Technology for 3D Sensor Integration

Reliable Sensor and CMOS IC Integration Concept Enables Smallest Form Factors
UNTERPREMSTAETTEN, Austria--(Business Wire)--
austriamicrosystems (SWX:AMS) business unit Full Service Foundry today announced
the availability of its patented Through Silicon Via (TSV) technology for
foundry customers. With the TSV technology two eight inch wafers can be
electrically connected. With typical TSV depths of 200um to 300um, it is
especially targeting 3D integration of CMOS ICs and sensor components. Due to a
flexible manufacturing concept customer specific modifications as well as
varying wafer thicknesses can be supported. The patented TSV manufacturing
technology is electrically proven and available for production.

The TSV technology addresses a variety of markets demanding 3D integration of
CMOS ICs, photo sensors, gas sensors, power devices or MEMS components such as
automotive, industrial & consumer applications. Foundry customers using the
austriamicrosystems TSV concept immediately benefit from a significantly reduced
form factor, systems cost reduction as well as performance improvements due to
shortened interconnect lengths. A proprietary back side re-distribution layer
concept enables various front and back side IO pad connections and provides
customers with utmost flexibility in IC and sensor arrangement.

"This new 3D integration technology further extends our portfolio of
industry-leading Mixed Signal Analog and High Voltage technologies and provides
customer-specific solutions for sensor integration. The innovative TSV
technology can be combined in a fully flexible manner with any of our 0.35um
analog specialty technologies such as CMOS, HV-CMOS, SiGe BiCMOS or embedded
Non-Volatile Memory. By providing our customers with early manufacturing access
to this new technology we can support them in realizing differentiated systems
solutions," states Thomas Riener, General Manager Business Unit Full Service
Foundry at austriamicrosystems.

"We see our role in providing designers with competitive advantages from
technology which further enhances the competitiveness of their products,"
comments Martin Schrems, Director of Process Development & Implementation at
austriamicrosystems. "In analogy to our leading High-Voltage CMOS technology we
have focused our TSV developments on creating a highly scalable, very low
complexity and cost-effective technology platform. Beyond that TSV is a
synergetic extension to our High-Voltage CMOS technology portfolio."

About austriamicrosystems
austriamicrosystems` business unit Full Service Foundry has successfully
positioned itself in the analog/mixed-signal foundry market offering
well-established RF CMOS, High-Voltage CMOS, BiCMOS and SiGe-BiCMOS processes.
With superior support during the design phase, high-end tools and experienced
engineers, austriamicrosystems succeeds to be an attractive analog foundry
partner especially for fabless design houses.

austriamicrosystems is a leading designer and manufacturer of high performance
analog ICs, combining more than 27 years of analog design capabilities and
system know-how with its own state-of-the-art manufacturing and test facilities.
austriamicrosystems leverages its expertise in low power and high accuracy to
provide industry-leading customized and standard analog products. Operating
worldwide with more than 1,000 employees, austriamicrosystems focuses on the
areas of power management, sensors & sensor interfaces, and mobile infotainment
in its markets Communications, Industry & Medical and Automotive, complemented
by its Full Service Foundry activities. austriamicrosystems is listed on the SIX
Swiss Exchange in Zurich (ticker: AMS). For more information, please visit
www.austriamicrosystems.com.

Press Contact
austriamicrosystems AG
Ulrike Anderwald
Marketing Communications Manager
Tel: +43 (0) 3136 500 5856
Fax: +43 (0) 3136 500 5420
press@austriamicrosystems.com
www.austriamicrosystems.com
or
Technical Contact
austriamicrosystems AG
Andreas Wild
Product Marketing Manager Full Service Foundry
Tel: +43 (0) 3136 500 4400
Fax: +43 (0) 3136 500 5420
andreas.wild@austriamicrosystems.com
www.austriamicrosystems.com

Copyright Business Wire 2009