Qualcomm Introduces Single-Chip 802.11n Wireless LAN Solution for Handsets and Mobile...

Qualcomm Introduces Single-Chip 802.11n Wireless LAN Solution for Handsets and
Mobile Devices

- High-Throughput Chip Offers Users Faster Downloads and Better Web Surfing,
Streaming Media Experiences -

TAIPEI, Taiwan, June 1 /PRNewswire-FirstCall/ -- Qualcomm Incorporated
(Nasdaq: QCOM), a leading developer and innovator of advanced wireless
technologies, products and services, today introduced the WCN1312(TM) - a
single-chip, high-performance 802.11n-compliant wireless local-area networking
(WLAN) solution for handsets and mobile devices. This highly integrated
device supports data rates of up to 72 Mbps - significantly higher than
previous 802.11a, b, and g Wi-Fi solutions - for a better user experience
while downloading data, watching streaming video or surfing the Internet.

"As demand increases for wireless LAN connectivity in handsets and other
mobile devices, carriers are migrating to higher-performance, more integrated
solutions," said Mike Concannon, senior vice president of Connectivity and
Wireless Modules for Qualcomm CDMA Technologies. "The new WCN1312 solution
gives our customers an extremely compact 802.11n solution with leading-edge
performance and full system-level integration with other Qualcomm chipsets,
which minimizes design time and reduces manufacturers' time-to-market."

The WCN1312 solution offers a high level of integration with a 2.4 GHz 802.11n
baseband processor, media-access controller, RF transceiver, transmit power
amplifier, low-noise amplifier, transmit switch, power coupler and
radio-frequency (RF) bandpass filter all in a small 7x7 mm package. This
simplified design eliminates the need for many external RF components,
minimizing the component count and resulting in a smaller system footprint.

The new WCN1312 chip uses low-power 65nm CMOS technology and advanced
power-management techniques to minimize sleep, standby and active power
consumption. It is optimized for performance with Qualcomm's complete Mobile
Station Modem(TM) (MSM(TM)) solutions and supports a variety of mobile
operating systems, including Qualcomm's Brew Mobile Platform(R), Android and
Windows Mobile. The WCN1312 chip is the industry's first mobile handset
device to support both 1x1 and 1x2 dual-receive configurations to increase
range and data throughput performance when needed. The WCN1312 solution also
implements advanced coexistence architecture and algorithms to optimize
performance when paired with Qualcomm's Bluetooth(R) solutions.

Scheduled for sampling in the second quarter, the WCN1312 chip is expected to
be in volume production by the fourth quarter of 2009, and is part of a
complete end-to-end solution for 802.11n from Qualcomm, which also includes
the WCN1320(TM) solution for consumer electronic devices.

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering
innovative digital wireless communications products and services based on CDMA
and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm
is included in the S&P 100 Index, the S&P 500 Index and is a 2009 FORTUNE
500(R) company. For more information, please visit www.qualcomm.com.

Except for the historical information contained herein, this news release
contains forward-looking statements that are subject to risks and
uncertainties, including the Company's ability to successfully design and have
manufactured significant quantities of the WCN1312 chip on a timely and
profitable basis, the extent and speed to which 802.11n-compliant wireless
local-area networking is adopted and deployed, change in economic conditions
of the various markets the Company serves, as well as the other risks detailed
from time to time in the Company's SEC reports, including the report on Form
10-K for the year ended September 28, 2008, and most recent Form 10-Q.

Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile Station
Modem, MSM, WCN1312 and WCN1320 are trademarks of Qualcomm Incorporated. All
other trademarks are the property of their respective owners.

Qualcomm Contacts:
Kira Lee Golin, Qualcomm CDMA Technologies
Phone: 1-858-651-1554
Email: qctpublicrelations@qualcomm.com

Tina Asmar, Corporate Communications
Phone: 1-858-845-5959
Email: corpcomm@qualcomm.com

John Gilbert, Investor Relations
Phone: 1-858-658-4813
Email: ir@qualcomm.com

SOURCE Qualcomm Incorporated

Kira Lee Golin, Qualcomm CDMA Technologies, +1-858-651-1554,
qctpublicrelations@qualcomm.com, or Tina Asmar, Corporate Communications,
+1-858-845-5959, corpcomm@qualcomm.com, or John Gilbert, Investor Relations,
+1-858-658-4813, ir@qualcomm.com, all of Qualcomm Incorporated