Call for Papers Now Open for 2009 Advanced Metallization Conference

Submission Deadline is June 26, 2009

BERKELEY, Calif., June 3 /PRNewswire-USNewswire/ -- UC Berkeley Extension
announced today that abstracts for paper presentations are now being accepted
for the 26th Advanced Metallization Conference (AMC) which will be held
October 13-15, 2009, in Baltimore, Maryland. The submission deadline for
abstracts is June 26, 2009.

The conference draws technical leaders from around the world to discuss
leading-edge research in the field of advanced metallization and 3-D
integration for ULSI IC applications. "The meeting provides a forum for open
discussion of critical issues affecting state-of-the-art and future directions
in interconnect systems. It's a great opportunity for collaboration on new
cutting-edge research," said Stefan E. Schulz, Professor for Nanoelectronics
Technologies at Chemnitz University of Technology, Germany and co-chair of the
conference. "This year we widened the thin film metallization paper topics to
include application in solar cells. We encourage experts in this area to share
their challenges and R&D results in metallization topics by submitting their
papers to AMC." Topics include both fundamental and applied research, as well
as advanced interconnect materials issues, manufacturing unit process
development, full integration data, interconnect reliability, and IC wiring
scaling.

Presentations must be original, non-commercial and non-published works, and
focus on ULSI IC metallization and associated subjects such as ultra low-k
dielectrics, scaling effects on resistance, diffusion barriers,
metal/dielectric planarization emphasizing CMP, electrochemical and
electroless deposition processes in advanced metallization, novel interconnect
systems concepts such as vertical, optical and RF issues, chip
interconnect/packaging interface including 3-D integration as well as
metallization technologies for micro-system-technology and solar cell
applications.

Abstracts of approximately 250 words are due by June 26, 2009. Abstracts
submitted electronically must be a PDF file with all fonts embedded. Send
abstracts to amc@unex.berkeley.edu.

Papers presented at the conference will be published by the Materials Research
Society. In the past, the books resulting from this meeting have been very
popular, and have found highest acceptance as information sources for advanced
metallization.

A complete list of topic areas for papers is available at:
www.unex.berkeley.edu/eng/metal/call.html#topics.

For additional information, please contact: amc@unex.berkeley.edu; (510)
642-4151

SOURCE UC Berkeley Extension

Pat Rose of UC Berkeley Extension, +1-415-817-1163