Jet and Flash(TM) Imprint Lithography (J-FIL(TM)) Continues to Gain Momentum as Molecular...

Jet and Flash(TM) Imprint Lithography (J-FIL(TM)) Continues to Gain Momentum
as Molecular Imprints Announces Progress at Key Industry Events

Relative merits of imprint lithography and EUV to be debated at the ConFab
conference

AUSTIN, Texas, June 10 /PRNewswire/ -- Molecular Imprints, Inc., the market
and technology leader for nanopatterning systems and solutions, today
announced that its innovative Jet and Flash Imprint Lithography (J-FIL)
nanopatterning solution continues to gain momentum in non-volatile memory
(NVM) markets, with the company progressing along its technology roadmap and
realizing key performance milestones. An important deadline is approaching to
make key decisions around selecting a new lithography technology for
high-volume, sub-32nm half-pitch semiconductor lithography. In support of
efforts to educate key decision makers about the resolution and
cost-of-ownership (CoO) advantages of J-FIL, Molecular Imprints will
participate in two key conferences where the relative merits of imprint
lithography and extreme ultraviolet (EUV) will be debated--at the Confab, a
global conference and business meeting for key decision makers on
semiconductor manufacturing; and at the SEMICON West Device Scaling TechXPOT.
In addition, Molecular Imprints will present on the adoption of J-FIL for
patterned media applications in hard disk drives (HDDs) at the DISKCON Japan
conference.

"Industry opinions are becoming increasingly favorable for J-FIL adoption in
the NVM manufacturing community, as key decision makers become aware of its
resolution and CoO advantages," said Ken Rygler, chief marketing officer at
Molecular Imprints. "The accelerating progress around J-FIL is shifting
industry perceptions about the use of imprint lithography in semiconductor
production to the point where it is now considered to be an equally viable
alternative to EUV for sub-32nm patterning."

The ConFab (June 14-17, 2009, Las Vegas, Nev.)
At the ConFab, a global conference and business meeting where key decision
makers from the semiconductor industry meet to discuss wafer fab manufacturing
and economic issues, as well as collaborate on future strategic development
activities, Molecular Imprints will participate on the panel "Lithography -
Imprint vs. EUV". Ben Eynon, vice president of semiconductor business
development for Molecular Imprints, will be joined by key representatives from
Intel, Nikon, Toshiba and Toppan Photomasks, to share their perspectives on
the capabilities, challenges and readiness of these two fundamentally
different lithographic approaches to meet future technology, affordability and
manufacturing requirements. The panel will take place during Session 3 on
Tuesday, June 16 from 8:45 to 10:15 a.m.

SEMICON West (July 14-16, 2009, San Francisco, Calif.)
At SEMICON West, Molecular Imprints will participate in the Lithography
Challenges and Solutions segment of the Device Scaling TechXPOT. The session
will focus on addressing the lithography issues around enabling volume IC
production at the 22nm node. Speakers from leading companies, including
Molecular Imprints, IBM, KLA-Tencor, Intel and Nikon, will detail the status
of J-FIL, EUV and double patterning, as well as address other pertinent
lithography infrastructure topics. Ben Eynon will discuss the coming adoption
of J-FIL in his presentation, "Nanoimprint: Affordable 22nm Lithography Now?"
which will be given on Wednesday, July 15 from 2:30 to 2:50 p.m.

DISKCON Japan (July 21-22, 2009, Tokyo)
At the DISKCON Japan conference, Paul Hofemann, vice president of marketing
and business development for HDD and emerging markets, will discuss the
emergence of J-FIL as the advanced lithography technology of choice for the
HDD industry. Hofemann will also summarize the path for imprint lithography
adoption in patterned media volume manufacturing, as well as detail key
technology and infrastructure highlights. His presentation, "From Possible to
Practical - The Evolution of Nanoimprint for Patterned Media," will be given
on Tuesday, July 21 at 1:00 p.m.

The increased visibility of Molecular Imprints has resulted from heightened
development activity and system sales in both the semiconductor and HDD
markets. The company has sold 12 development and pre-production systems into
these markets over the past two years. This activity is expected to increase
through the second half of 2009 and into 2010 and beyond.

About Molecular Imprints, Inc.
Molecular Imprints, Inc. (MII) is the technology leader for high-resolution,
low cost-of-ownership nanopatterning systems and solutions in the hard disk
drive (HDD) and semiconductor industries. MII is leveraging its innovative
Jet and Flash(TM) Imprint Lithography (J-FIL(TM)) with IntelliJet(TM) material
application technology to become the worldwide market and technology leader in
high-volume patterning solutions for storage and memory devices, while
enabling emerging markets in optics, biotechnology, and other industries. MII
enables nanoscale patterning by delivering a comprehensive nanopatterning
solution that is affordable, compatible and extendible to sub-10-nanometer
resolution levels. For more information, visit www.molecularimprints.com.

SOURCE Molecular Imprints, Inc.

Ken Rygler of Molecular Imprints, Inc., +1-512-339-7760, ext. 313,
krygler@molecularimprints.com; or David Moreno of MCA, +1-650-968-8900, ext.
1251, dmoreno@mcapr.com, for Molecular Imprints, Inc.