Schreiner ProTech Unveils Innovative Miniaturized Labeling Solutions for Very Small...

Schreiner ProTech Unveils Innovative Miniaturized Labeling Solutions for Very
Small Assembly Components

Schreiner ProTech's Miniature Double-Sided Self-Adhesive Die-Cut Parts Offer a
Clever Connection with Clear-Cut Benefits

SOUTHFIELD, Mich., June 30 /PRNewswire/ -- Schreiner ProTech today announced
the introduction of its miniature double-sided adhesive parts (Mini-DSAPs),
especially designed for very small assembly components. Miniaturized labeling
solutions (4x4 millimeters), the Mini-DSAPs provide an alternative to
conventional bonding and joining techniques like liquid gluing, bolting,
soldering or ultrasonic welding.

Conventional methods quickly reach their limits when it comes to attaching
miniaturized components to other very small components, like printed circuit
boards. With the Mini-DSAPs, Schreiner ProTech offers a new, highly-reliable
solution to join extremely small parts to any other miniature assembly
components.

Unlike liquid adhesives, the Mini-DSAPs offer instantaneous adhesion with very
low maintenance. While liquid adhesives are applied to the substrate by
dispensers with nozzles that need to be regularly cleaned up, the Mini-DSAPs
can be easily processed manually or by means of efficient automatic insertion
equipment which precisely positions the Mini-DSAPs and accelerates the
manufacturing process. Additionally, the Mini-DSAPs' bond requires no curing,
eliminating the need for additional equipment like drying ovens or lines and
saving production costs while speeding up the assembly process.

The Mini-DSAPs are tailored to meet the customer's specifications and ensure
efficient, fast and clean handling, depending on the bonding substrate and
application requirements. If needed, Schreiner ProTech can also deliver
Mini-DSAPs with extra value-added functionalities. The joining elements can be
available with specific thermal conductivity properties for use in electronic
components requiring dissipation of the heat they generate.

As the steady trend toward miniaturization continues to reduce assembly
components to smaller dimensions, Schreiner ProTech's customizable Mini-DSAPs
provide manufacturers with a highly-reliable, cost-effective labeling solution
ideal for such applications.

About Schreiner ProTech
As a certified systems supplier and development partner, the Schreiner
High-Tech Group of Companies designs intelligent solutions in seven
specialized divisions. Schreiner ProTech's objective of "making industrial
labeling and manufacturing processes more efficient and leaner" is pursued
through the development of innovative, increasingly intelligent functional
films for engineering industries.

SOURCE Schreiner ProTech

Pascale Marchand - Media Relations of Bob Gold & Associates, +1-310-784-1040,
pascale@bobgoldpr.com, for Schreiner ProTech; or SCHREINER PROTECH NORTH
AMERICA, INC., A division of Schreiner Group GmbH & Co. KG, Steven Pasbjerg,
Officer and Director Sales, +1-248-355-3006, Toll free, 888-888-8564,
pasbjerg@schreiner-protech-na.com