QuickLogic CSSP Adds Additional Capability to Icera`s Espresso 300 3G Soft Modem Solution for Rapidly Growing USB Modem Market

* ArcticLink CSSP Platform Used with Icera`s Espresso 300 3G Soft Modem
Reference Platform Solution Now in Production
* Offers Increased Performance and Efficiency Between USB 2.0 Host Interface and
Onboard Micro SD/SDHC Memory Card Interfaces

SUNNYVALE, Calif.--(Business Wire)--
QuickLogic Corporation (NASDAQ: QUIK), the lowest power programmable solutions
leader, today announced the selection of its Customer Specific Standard Product
(CSSP), based on the ArcticLink solution platform, for the Icera Espresso 300 3G
soft modem platform, that is now entering production.

Icera is a leader in software-defined wireless chipsets and is the only company
to deliver software-based cellular modems for broadband data cards, USB sticks,
and mobile internet devices. Icera`s reference design uses a wafer-level chip
scale (WLCSP) version of the ArcticLink solution platform to compliment its
second-generation baseband chip design. QuickLogic provides higher speed, smart
data transfers between USB and SD/SDHC memory via QuickLogic`s innovative Smart
Programmable Integrated Data Aggregator (SPIDA) system block.

Mobile data service providers anticipate customer demand for USB-based broadband
data cards to reach nearly 40 million units in 2009, according to the market
research firm ABI Research. By working with QuickLogic, Icera was able to
rapidly address the emerging market for USB data cards that incorporate a micro
SD/SDHC memory card interface. By using the QuickLogic CSSP, based on the
ArcticLink solution platform, Icera was able to quickly adapt their leading edge
USB data card reference design, without compromising power consumption or
impacting performance - in terms of both the modem and the USB-to-SD/SDHC memory
transfers. As a result, consumers can now have one USB device plugged into their
PC, incorporating both a cellular modem and removable memory function.

"QuickLogic`s technology and capabilities were key to our ability to quickly
respond to the shifting market requirements without compromises," said Rick
Dingle, vice president of Customer Engineering at Icera. "The CSSP approach and
the use of QuickLogic`s SPIDA-proven system block embedded within the ArcticLink
solution platform provided us with the opportunity to work with QuickLogic on
architecting and adapting the solution for power and performance efficiencies.
By working directly with QuickLogic`s architecture and development teams, Icera
was able to go from specification to first samples in less than eight weeks."

"QuickLogic`s CSSP solutions provide innovative companies such as Icera with the
flexibility to implement custom designs optimized for power consumption and
performance while saving them the time, expense and effort of spinning base
platform silicon," said Andrew J. Pease, QuickLogic`s president. "Because CSSPs
are not customized until after fabrication and test, we have an appropriate die
bank awaiting the needs of many different customers, giving them customized
solutions at standard product pricing and availability."

The ArcticLink-based CSSP that Icera chose belongs to a family of solution
platforms that embed a unique combination of QuickLogic`s patented ViaLink
programmable fabric technology and hard-wired logic for commonly requested
functions to maximize speed, and minimize power consumption and cost. QuickLogic
implemented additional proven system blocks (PSBs) with state-of-the-art power
consumption and performance characteristics in the programmable fabric to meet
specific customer requirements. This breadth of functions gives customers the
ability to quickly receive a customer specific design with the right combination
of functionality, performance, size, and cost without the delays and expense
that characterize other custom design approaches.

About QuickLogic

QuickLogic Corporation (NASDAQ: QUIK) is the inventor and pioneer of innovative,
customizable semiconductor solutions for mobile and portable electronics OEMs
and ODMs. These silicon plus software solutions are called Customer Specific
Standard Products (CSSPs). CSSPs enable our customers to bring their products to
market more quickly and remain in the market longer, with the low power, cost
and size demanded by the mobile and portable electronics market. For more
information about QuickLogic and CSSPs, visit www.quicklogic.com.

About Icera

Icera is a fabless semiconductor company, pioneering high performance, low
power, soft modem chipsets for the fast growing mobile broadband device market.
Icera technology delivers the highest performance modem solutions for USB
dongles, datacards, laptops, mobile internet devices and smartphones. Founded in
2002, Icera is headquartered in the UK, with design locations in the UK, France
and North America, with customer engineering and sales offices in Europe, Asia
and the USA. For more information, visit the Icera web site at
www.icerasemi.com.

The QuickLogic name, ViaLink and ArcticLink are registered trademarks of and the
QuickLogic logo is a trademark of QuickLogic Corporation.All other brands or
trademarks are the property of their respective holders and should be treated as
such.

Code: QUIK-G

QuickLogic Corporation
Andrea Vedanayagam
Director, Corporate Communications
408-990-4000
andrea@quicklogic.com

Copyright Business Wire 2009