Corning and Soitec to Work Together on the Development of Advanced Substrates for OLED Mobile Displays

CORNING, N.Y. & BERNIN, France--(Business Wire)--
Corning Incorporated (NYSE:GLW) and the Soitec Group (Euronext Paris) today
announced an agreement to work together on the development of high-performance
silicon-on-glass (SiOG) substrates for the flat panel mobile display market. The
two companies will focus their efforts on top-performance backplane substrate
technology for organic light-emitting diode (OLED) mobile displays.

Key challenges to broad commercialization of the high-quality, cost-effective
displays promised by mobile OLED technology, including backplane electron
mobility and uniformity, and lower total system cost, are being addressed by
this codevelopment work. In turn, outstanding electrical backplane performance
should enable display manufacturers to achieve complex circuit integration and
simplified processing.

"We are pleased to be working with Soitec, a leader in silicon-on-insulator
(SOI) and silicon film transfer technology for the semiconductor industry," said
Dr. Mark A. Newhouse, senior vice president and director, New Business
Development, Corning Incorporated. "This co-development work should lead to
faster delivery of our SiOG substrates, which can enable the development of
high-quality, cost-effective OLED displays," he added.

"This cooperative effort between Corning and Soitec is a natural extension of
both companies` core competencies. Together we hope to create low-cost,
high-performance substrates for the mobile flat panel market," said
André-Jacques Auberton-Hervé, president, the Soitec Group. "In addition to the
focus on mobile display substrates, the codevelopment work can explore
alternative applications for engineered substrates using glass and semiconductor
thin films, which could significantly enlarge our portfolio of applications."

Corning's silicon-on-glass technology, currently in development, is a thin,
single-crystal silicon film applied to Corning display glass. This development
is expected to produce an engineered substrate with outstanding electrical
mobility and material uniformity, upon which electronic circuits can be easily
applied by display manufacturers. The first applications for this technology are
anticipated to be small- to medium-sized mobile display devices.

Soitec's proprietary Smart Cut technology is used to transfer ultra-thin single
crystal layers of wafer substrate material (such as silicon) onto another
surface. This proven technique is used to fabricate more than 90 percent of SOI
production wafers in the semiconductor industry. Soitec's unique expertise and
industrial capabilities, along with its continuous product and process
improvements, should be key to accelerating SiOG technology for new market
applications.

About Corning Incorporated

Corning Incorporated (www.corning.com) is the world leader in specialty glass
and ceramics. Drawing on more than 150 years of materials science and process
engineering knowledge, Corning creates and makes keystone components that enable
high-technology systems for consumer electronics, mobile emissions control,
telecommunications and life sciences. Our products include glass substrates for
LCD televisions, computer monitors and laptops; ceramic substrates and filters
for mobile emission control systems; optical fiber, cable, hardware & equipment
for telecommunications networks; optical biosensors for drug discovery; and
other advanced optics and specialty glass solutions for a number of industries
including semiconductor, aerospace, defense, astronomy and metrology.

About the Soitec Group

The Soitec Group (www.soitec.com) is the world`s leading innovator and provider
of the engineered substrate solutions that serve as the foundation for today`s
most advanced microelectronic products. The group leverages its proprietary
Smart Cut technology to engineer new substrate solutions, such as
silicon-on-insulator (SOI) wafers, which became the first high-volume
application for this proprietary technology. Since then, SOI has emerged as the
material platform of the future, enabling the production of higher performing,
faster chips that consume less power. Soitec currently produces more than 90
percent of SOI wafers. Headquartered at Bernin in France, with two high-volume
production units on site and one in Singapore, Soitec also has offices in the
U.S., Japan and Taiwan.

Corning Media Relations:
M. Elizabeth Dann, 607-974-4989
dannme@corning.com
or
Kelli C. Hopp-Michlosky, 607-974-1657
hoppkc@corning.com
or
Corning Investor Relations:
Kenneth C. Sofio, 607-974-7705
sofiokc@corning.com
or
Soitec Media Relations:
Camille Darnaud-Dufour, +33 (0) 6 79 49 51 43
camille.darnaud-dufour@soitec.com

Copyright Business Wire 2009