Research and Markets: IPD - Report 2009: Technologies, Applications, Markets & Players - The First Complete Study on Thin Film Integrated Passive & Active Devices

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Thu Aug 27, 2009 4:53am EDT

DUBLIN--(Business Wire)--
Research and Markets
(http://www.researchandmarkets.com/research/d40329/ipd_report_2009) has
announced the addition of the "IPD - Report 2009: Technologies, Applications,
Markets & Players" report to their offering. 

The first complete study on Thin Film Integrated Passive & Active Devices 

MARKET TRENDS 

From a commodity technology initially developed to replace bulky discrete
passive components, thin-film Integrated Passive Devices (IPD's) are now a
growing industry trend driven by ESD/EMI protection, RF, High Brightness LEDs,
Digital & Mixed Signal applications. 

New research study on Thin-film Integrated Passive and Active devices estimates
the total IPD market to grow from more than $600M this year to over $1B by 2013.
Whether it is to reduce space on the application board, to enhance performance
or to reduce cost at the system level, IPD's are spreading to most electronic
sectors, from low volume to mass market businesses in aerospace, military,
medical, industrial, lighting, communications, and PC applications. 

Over the past few years, IPD's have become an essential enabler of
System-in-Packages (SiP) realizations. Looking to tomorrow, IPD's are paving the
way to the bright future of the "More than Moore" heterogeneous integration as
they contribute greatly to bridging the increasing gap between the ever
shrinking geometries of CMOS IC's and the lagging packaging technologies. IPD's
enable the assembly of increasingly complete and autonomous systems with the
integration of diverse electronic functions such as sensors, RF transceivers,
MEMS, power amplifiers, power management units and digital processors. 

At the frontier between the back-end and the front-end of the semiconductor
industry, Thin-film IPD's are poised to extend the use of Wafer-Level Packaging
(WLP) and Through silicon Via (TSV) technology platforms to many IC package
solutions as well as to the discrete passive component industry. Being a "bridge
platform", IPD's involve the complete semiconductor value chain: equipment;
material providers; fabless semiconductor players; integrated device
manufacturers; CMOS foundries; MEMS players; substrate suppliers; and OSAT
industry, are all concerned by the need to increase their value proposition in
the future through the extensive integration of thin film integrated passive and
active devices. In this report, you will find comprehensive links between the
different IPD technologies and each of their applications. Market share, supply
value chain and strategies of the current major players and those looking at
entering this business have been identified. 

IPD technology trends, manufacturing options and challenges to be addressed are
discussed and detailed. Finally, a complete market segmentation for the
commercialization of IPD's is proposed. Market forecasts and attached growth
rates for each segment are provided for 2008-2015. 

KEY FEATURES OF THE STUDY

* Four application fields investigated (ESD/EMI protection, HB-LED silicon
submounts, RF and Digital & Mixed signal IPD) 
* Market trends and figures provided both in M$, Munits and wafer size
equivalent 
* Complete technologies and material tool-box analysis 
* 30 detailed company profiles of key IPD players 
* 320+ pages

This new study exhaustively lists the existing and upcoming technologies and
applications for IPDs. The report not only describes the market and the
associated technologies deep inside the applications, but it also provides a
broad overview of the thin-film IPD market and its forthcoming growth
opportunities. 

Each market sub-segment is exhaustively detailed with:

* Drivers and benefits of IPDs 
* Sub-segment size and expected growth rate 
* Value chain analysis 
* Global market evaluation per application: volume in units, wafers, and market
size ($) 
* Evaluation of the major market players (market share)

WHO SHOULD BUY THE REPORT

* IPD manufacturers 
* Integrated semiconductor Device Manufacturers 
* Assembly and Test Service companies 
* Electronic module makers and Original Equipment Makers 
* Equipment and Material manufacturers 
* PCB manufacturers 
* Discrete component makers 
* Financial and strategic investors 
* Foundries

Key Topics Covered:

1. Introduction, definitions & scope of the report P10 

2. Thin film IPD applications and market drivers P35 

3. Thin film IPD Market status and 2008-2015 forecasts P67 

4. Thin film IPD technologies P95 

5. Thin film IPD architectures, assembly & packaging P148 

6. Thin film IPD Supply chain & Players P172 

7. Conclusions & Perspectives P223 

8. "Top 30" COMPANY PROFILES 

For more information visit
http://www.researchandmarkets.com/research/d40329/ipd_report_2009



Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
Fax (USA): 646-607-1907
Fax (International): +353-1-481-1716 

Copyright Business Wire 2009

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