ANSYS Releases HFSS 12.0 Engineering Simulation Software

Thu Sep 17, 2009 7:25am EDT

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Industry-Standard RF & Microwave Simulation Solution Delivers Significant New
Domain Decomposition Technology for High-Performance Computing
SOUTHPOINTE, Pa.--(Business Wire)--
ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and
technologies designed to optimize product development processes, today announced
the release of HFSS™ 12.0 software, the industry-leading technology for 3-D
full-wave electromagnetic field simulation. The product, part of the Ansoft
suite, helps engineers design, simulate and validate the behavior of complex
high-performance radio frequency (RF), microwave and millimeter-wave devices in
next-generation wireless communication and defense systems. A key
high-performance computing (HPC) enhancement, domain decomposition, allows
engineers to simulate and design at a scale and speed never before possible.
Users of this latest version of HFSS software can achieve a dramatic reduction
in development time and costs while at the same time realizing increased
reliability and design optimization. 

With the release of HFSS 12.0, ANSYS follows through on its commitment to
deliver technology with unequalled depth and unparalleled breadth. HFSS 12.0 is
a major step forward for three-dimensional full-wave electromagnetic field
simulation. The software includes key updates in mesh generation, solver
technologies, and enhancements to the user interface and the modeler. A new,
faster and more robust meshing algorithm generates higher-quality, more
efficient tetrahedral meshes. The most significant solver technology enhancement
is domain decomposition, a technique that allows HFSS to exploit HPC
capabilities to solve electromagnetic field problems of unprecedented size and
scope. Other important enhancements include mixed element orders, curvilinear
elements, and adjoint derivative computation. Ease of use and automation in the
user interface have been improved and include additional modeler capabilities
such as sheet wrapping and imprinting. These advances in HFSS 12.0 enable
electrical engineers to expand their solution capability, exploit HPC hardware
and fully integrate electromagnetics analysis into their Simulation Driven
Product Development™ processes. 

"HFSS 12.0 is a breakthrough in high-frequency electromagnetic field
simulation," said Zol Cendes, chief technology officer and general manager at
Ansoft. "For the first time, engineers are able to solve vast electromagnetic
field problems with speed, efficiency and accuracy. Because of domain
decomposition, microwave and electronics engineers now have the opportunity to
successfully address a new range of problems containing hundreds of millions of
unknowns that previously could not be addressed by simulation. The ANSYS focus
on developing simulation technology that takes full advantage of modern computer
hardware solutions means that customers will have future capabilities that,
today, we can only imagine." 

The new domain decomposition technology in HFSS 12.0 software allows efficient
and highly scalable parallelized simulations across multiple computer cores
including networked cores. In running a 15-GB benchmark on an HP 7880
workstation, domain decomposition using eight cores exhibited an 8.8-times
speedup with a 33 percent memory savings compared to a single-core direct solve.


Curvilinear elements and mixed element orders allow for higher accuracy and more
efficient distribution of computational resources. Curvilinear elements model
the fields exactly on curved surfaces and in these cases provide higher accuracy
even with a coarser mesh discretization. Mixed element orders allows for an
automated and judicious localized application of element order. Smaller features
are solved more efficiently by lower-order elements while large homogenous
regions benefit from higher-order elements, all element orders being
automatically and appropriately "mixed" in one mesh. 

Molex Incorporated, a leading supplier of electronic connectors and interconnect
products, was among the organizations that participated in beta testing the new
release. The company investigated a number of features, including the new TAU
volumetric meshing technique, whose robust tet mesh elements reduce the overall
load on the solver. "The new TAU meshing and mixed element orders technology in
HFSS 12.0 will allow Molex engineers to more accurately and efficiently simulate
and design," said Dave Dunham, engineering director at Molex. "We have more than
doubled productivity with the implementation of HFSS 12.0 in our design flow." 

Adjoint derivative computation provides a highly efficient and accurate
procedure to evaluate the derivatives of S-parameters with respect to geometric
and material model parameter variations. This technique provides sensitivity
information for use in device tuning, tolerance evaluation and optimization.
These derivatives are employed to speed up the sequential nonlinear programming
(SNLP) optimizer included with the Optimetrics add-on program. 

New features in HFSS 12.0 software include:

* New TAU meshing technology 
* Domain decomposition solver technology 
* Curvilinear elements 
* Mixed element orders 
* Adjoint derivative computation 
* Update to ACIS R19.2 
* Improved link with ANSYS® DesignXplorer™ software

For downloadable images, visit http://www.ansys.com/newsimages. 

About ANSYS, Inc.
ANSYS, Inc., founded in 1970, develops and globally markets engineering
simulation software and technologies widely used by engineers and designers
across a broad spectrum of industries. The Company focuses on the development of
open and flexible solutions that enable users to analyze designs directly on the
desktop, providing a common platform for fast, efficient and cost-conscious
product development, from design concept to final-stage testing and validation.
The Company and its global network of channel partners provide sales, support
and training for customers. Headquartered in Canonsburg, Pennsylvania, U.S.A.,
with more than 60 strategic sales locations throughout the world, ANSYS, Inc.
and its subsidiaries employ over 1,600 people and distribute ANSYS products
through a network of channel partners in over 40 countries. Visit www.ansys.com
for more information. 

ANSYS, ANSYS Workbench, Ansoft, AUTODYN, CFX, FLUENT, and any and all ANSYS,
Inc. brand, product, service and feature names, logos and slogans are registered
trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States
or other countries. All other brand, product, service and feature names or
trademarks are the property of their respective owners.

Technology: ANSS-T 



ANSYS, Inc.
Media:
Kelly Wall, 724-514-3076
kelly.wall@ansys.com
or
Investors:
Annette Arribas, 724-514-1782
annette.arribas@ansys.com

Copyright Business Wire 2009