Novellus' SPEED(R) Max HDP-CVD Dielectric Gapfill System Extends STI Application to 32 nm

Novellus' SPEED(R) Max HDP-CVD Dielectric Gapfill System Extends STI
Application to 32 nm
Advanced SPM-F(TM) Technology Eliminates Ex-situ Wet Etch Processing;
Increases Fab Productivity

SAN JOSE, Calif., Oct. 5 /PRNewswire-FirstCall/ -- Novellus Systems (Nasdaq:
NVLS) today announced that it has developed a manufacturing process to extend
the company's SPEED Max shallow trench isolation (STI) application to the 32
nm technology node. The new process technology takes advantage of the dynamic
profile control (DPC(TM)) of the SPEED Max high density plasma chemical vapor
deposition (HDP-CVD) platform. By tailoring the deposition, etch, and
sputter-to-deposition (S/D) ratio, Novellus engineers have developed a
single-pass, sequential profile modulation technique using fluorine (SPM-F) to
fill 32 nm features. The process meets the stringent integration requirements
of STI logic applications and the productivity required for high volume
manufacturing.

(Photo: http://www.newscom.com/cgi-bin/prnh/20091005/SF86536)

As semiconductor manufacturers move to 32 nm and beyond, the need to extend
technology on existing platforms with minimal hardware modifications is
critical, not only to meet development schedules, but also to manage
manufacturing costs. Since new material changes add significant integration
uncertainty, and many alternative films and deposition techniques have
qualities that are undesirable, HDP is still the preferred gapfill dielectric
technology for advanced geometries. However, to achieve complete gapfill at 32
nm and beyond, conventional HDP deposition processes that utilize alternating
deposition and etch cycles to fill a feature must be carefully controlled. Too
many deposition/etch cycles, or inadequate control of process uniformity, will
result in excessive clipping or voids within the trenches (as shown in figure
1), leading to yield loss. Insufficient gapfill can be overcome by adding an
ex-situ wet etch process, but at the cost of added defects, integration
complexity, and lower productivity. To achieve complete gapfill without the
use of an ex-situ wet etch step, parameters like S/D ratio, process chemistry,
and etch uniformity must be optimized across the wafer.

Novellus has developed a unique SPM-F gapfill process using the SPEED Max
platform that eliminates the need for an ex-situ wet etchback step. Using
SPEED Max's isolated plasma source and DPC technology, complete fill of 32 nm
structures was achieved (see figure 2) by reducing the oxide top-hat build-up,
and eliminating clipping in both dense arrays and isolated features. By
eliminating the need for an external wet etchback step, the new SPEED Max
SPM-F process also meets the productivity and defect requirements of 32 nm
high-volume manufacturing.

"The gapfill and defectivity results we achieved on 32 nm structures allowed
us to back-qualify the SPEED Max process to a previous technology node and
eliminate ex-situ wet etch processing," said Dr. Kaihan Ashtiani, vice
president and general manager of the Gapfill business unit. "This eliminates a
second wafer pass through the HDP tool, resulting in an increased fab
productivity."

For more information regarding SPEED Max's STI application at 32 nm, go to
www.novellustechnews.com.

About Novellus' HDP-CVD Technology:

Novellus' SPEED Max system extends the HDP-CVD application into the 45 and 32
nm technology nodes. The system's isothermal chamber design, combined with an
enlarged remote plasma source, allows more wafers to be processed between
plasma cleans, and delivers superior throughput per system. In addition, the
SPEED Max multi-port injection, together with isolated source technology,
customizes the deposition and in-situ etching profile for optimal film
thickness and gapfill uniformity across the wafer.

About Novellus:

Novellus Systems, Inc. (Nasdaq: NVLS) is a leading provider of advanced
process equipment for the global semiconductor industry. The company's
products deliver value to customers by providing innovative technology backed
by trusted productivity. An S&P 500 company, Novellus is headquartered in San
Jose, Calif. with subsidiary offices across the globe. For more information,
please visit www.novellus.com

SOURCE Novellus Systems

Bob Climo of Novellus Systems, Inc., + 1-408-943-9700, bob.climo@novellus.com;
or Marla Kertzman of The Hoffman Agency, + 1-408-975-3032,
mkertzman@hoffman.com, for Novellus Systems, Inc.