INSIDE Contactless Opens Asia Testing Facility

New Bangkok Office and Testing Facility to Help Expand MicroPass Production
Capacity

AIX-EN-PROVENCE, France--(Business Wire)--
Expanding its operations in Asia, INSIDE Contactless, the world leader in
advanced open-standard contactless chip technologies, today announced the
opening of a representative office in Bangkok, Thailand to coordinate
engineering support for its production subcontractors throughout Asia, including
a new secured semiconductor probing facility in Bangkok operated by United Test
and Assembly Center Ltd (UTAC). The new Bangkok operations will play an
important role as INSIDE prepares to increase its production capacity to handle
an anticipated demand of up to 500 million MicroPass contactless payment
microprocessors annually.

"By opening this office in Bangkok, we are taking an important strategic step to
help expand our subcontracted production facilities in Asia and improve
operations with them to ensure we meet our quality and production goals," said
Damien Laroche, executive vice president of manufacturing and operations at
INSIDE. "This Bangkok office will play a central logistical role in coordinating
the manufacturing of our EMV payment processors, and will help INSIDE achieve a
more efficient supply chain with its subcontractors."

The new office will operate under the direction of Worrawut Poonsuk, an
experienced test engineer, who will also coordinate production with INSIDE`s
manufacturing subcontractors in Asia. Approved by EMVCo, the new subcontracted
probing facility will test EMV-certified MicroPass contactless payment
microprocessors manufactured in Singapore and destined for INSIDE`s customers
across Asia and other parts of the world.

The Bangkok office and testing facility expand INSIDE`s global footprint, which
also includes manufacturing facilities and sales and engineering offices in
Silicon Valley, Boston, Warsaw, Aix-en-Provence, Singapore, Shanghai and Seoul.

About INSIDE Contactless

INSIDE Contactless is the global leader in open-standard contactless payment and
Near Field Communication (NFC) semiconductors and software that power the next
generation of payment, transit, identity and access control applications. The
company`s intelligent, microprocessor-based platforms offer the flexibility to
be embedded in smart cards, mobile phones and other consumer electronic devices,
documents, badges and other items to support a wide range of innovative
contactless applications and bring new levels of convenience to users. INSIDE
has delivered more than 300 million contactless platforms worldwide to customers
and partners that include many of the leading payment card and mobile phone
manufacturers, systems integrators and financial institutions. With a portfolio
of 60 families of patents, including several essential NFC patents, the company
has played a leading role in NFC and contactless innovation. INSIDE is
headquartered in Aix-en-Provence, France, with offices in Shanghai, Singapore,
Warsaw, Seoul and Silicon Valley. For more information, please visit
www.insidecontactless.com.

For INSIDE Contactless:
Corman Communications, LLC
Patrick Corman, 650-326-9648
patrick@cormancom.com
www.cormancom.com
or
INSIDE company contact:
Geraldine Sauniere, +33 (0) 4 42 39 33 01
Marcom Director
gsauniere@insidefr.com

Copyright Business Wire 2009