eBeam Initiative Introduces Design for E-Beam Methodology Guidelines and Training Courses

eBeam Initiative Introduces Design for E-Beam Methodology Guidelines and
Training Courses
Guidelines and Training Build on Milestones Achieved During 2009

SAN JOSE, Calif., Nov. 9 /PRNewswire/ -- The eBeam Initiative, a forum
dedicated to the education and promotion of a new design-to-manufacturing
approach known as design for e-beam (DFEB), today announced the availability
of DFEB methodology guidelines and training sessions for physical design
engineers, which will be made available to members and non-members. DFEB is a
design-to-manufacturing approach to enhance the throughput of e-beam (EB)
lithographic exposure. During 2009, eBeam Initiative members collaborated on
manufacturability proof points, silicon validation of the DFEB design
methodology and validation of the Packed Stencil technology to further enhance
EB throughput. The guidelines and training reflect the tangible progress on
the Initiative's roadmap and its mission to educate the semiconductor
community about DFEB.

The first version of the DFEB methodology guidelines will be made available on
November 9, 2009 and can be accessed by going to www.ebeam.org. On November
24, 2009 Cadence Design Systems Japan will host a morning and afternoon DFEB
training session at its Shin-Yokohama office with the training conducted in
Japanese. The local training is scheduled for December 9, 2009( )in building
8 of Cadence Design Systems' San Jose, Calif. office. Cadence Design Systems,
D2S and e-Shuttle are sponsoring the training sessions at no cost to
attendees. For both locations, the morning session will take place from 10:00
a.m.-1:00 p.m. (includes lunch) and is intended for management and physical
design engineers. The afternoon segment is dedicated to physical design
engineers only and will run from 1:00 p.m.-3:00 p.m. Registration is now open
via the Initiative's website.

"These educational tools will demonstrate the DFEB benefits to the design
community as well as educate them about the technology trends in e-beam
manufacturing," stated Aki Fujimura, CEO of D2S and managing sponsor of the
eBeam Initiative. "Providing methodology guidelines and training sessions at
this time reflects great progress by the Initiative members in validating the
DFEB methodology in 2009 consistent with the Initiative's roadmap."

The eBeam Initiative was launched in February 2009 and includes a total of 21
leading companies throughout the entire semiconductor ecosystem to promote
DFEB technology. Further details of the eBeam Initiative can be found at
www.ebeam.org.

U.S. Training Course Japan Training Course
Cadence Design Systems Cadence Design Systems Japan

2655 Seely Avenue 2-100-45 Shin-Yokohama, Kohoku-ku
San Jose, CA 95134 Yokohama 222-0033, Japan

About Design for E-beam (DFEB)
DFEB is a design-to-manufacturing approach to enhance the throughput of e-beam
(EB) lithographic exposure. DFEB uses character or cell projection (CP)
technology combined with design and software techniques to reduce a design's
required shot count, resulting in increased CP e-beam direct-write (EbDW)
throughput. A new technology backgrounder on DFEB is available on the eBeam
Initiative website, www.ebeam.org.

About The eBeam Initiative
The eBeam Initiative provides a forum for educational and promotional
activities regarding a new design-to-manufacturing approach, known as design
for e-beam (DFEB). DFEB reduces mask costs for semiconductor devices by
combining design, design software, manufacturing, manufacturing equipment and
manufacturing software expertise. The goals of the Initiative are to reduce
the barriers to adoption to enable more integrated circuit (IC) design starts
and faster time-to-market while increasing the investment in DFEB throughout
the semiconductor ecosystem. Members and advisors, which span the
semiconductor ecosystem, include: Advantest, Alchip Technologies, Altos Design
Automation, Cadence Design Systems, CEA/Leti, D2S, Dai Nippon Printing, Marty
Deneroff from D. E. Shaw Research, e-Shuttle, Jack Harding from eSilicon
Corporation, Fastrack Design, Fujitsu Microelectronics, GenISys GmbH, Magma
Design Automation, Colin Harris from PMC-Sierra, Riko Radojcic from Qualcomm,
STMicroelectronics, Tela Innovations, Toppan Printing, Virage Logic and Vistec
Electron Beam Lithography Group. Membership is open to all companies and
institutions throughout the electronics industry. To find out more, please
visit www.ebeam.org.

SOURCE The eBeam Initiative

Kelly Picasso of MCA, +1-650-968-8900, ext. 127, kpicasso@mcapr.com