Qualcomm Now Sampling Industry's First Dual-carrier HSPA+ and Multi-Mode 3G/LTE Chipsets for Global Markets

Qualcomm Now Sampling Industry's First Dual-carrier HSPA+ and Multi-Mode
3G/LTE Chipsets for Global Markets
- Trend Shows Industry Coming Together for Widespread Deployment of Two
Advanced Network Technologies in 2010 -

SAN DIEGO, Nov. 12 /PRNewswire-FirstCall/ -- Qualcomm Incorporated (Nasdaq:
QCOM), a leading developer and innovator of advanced wireless technologies,
products and services, today announced that it is sampling the industry's
first chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. The Mobile Data
Modem(TM) (MDM(TM)) MDM8220(TM) solution is the first chipset to support
Dual-carrier High-Speed Packet Access Plus (DC-HSPA+); and the MDM9200(TM) and
the MDM9600(TM) chipsets are the industry's first multi-mode 3G/Long Term
Evolution (LTE) solutions. These chipsets demonstrate significant progress
toward enabling the mass-market commercial deployment of two next-generation
network technologies that bring more advanced data capabilities to mobile
devices for new global markets in addition to North America.

Dual-carrier HSPA+ and LTE are network innovations that provide the ability to
deliver more advanced data capabilities to mobile devices, supporting more
compelling applications and richer user experiences. A wide variety of
network operators, infrastructure vendors and mobile device manufacturers are
now working with Qualcomm to enable the deployment of these next-generation
network technologies in new markets worldwide. Interoperability testing with
infrastructure partners is already underway with multiple field trials
scheduled for the first half of next year. Commercial launches of
data-centric devices based on Qualcomm's MDM solutions are expected to begin
during the second half of 2010.

"Qualcomm leads the industry in enabling next-generation mobile experiences
with highly integrated, powerful and elegant solutions for dual-carrier HSPA+
and LTE. We are pleased to be working with so many industry leaders to bring
these advanced technologies to market," said Alex Katouzian, vice president of
product management, Qualcomm CDMA Technologies. "We remain committed to CDMA
and OFDMA WAN modem leadership and the seamless and cost-effective
commercialization of next-generation technologies around the world."

Qualcomm is working with numerous network operators, infrastructure vendors
and device manufacturers with its dual-carrier HSPA+ and/or LTE solutions.
Among multiple network operators evaluating the new technologies are Japan's
EMOBILE Ltd. and Telstra Wireless. Qualcomm is also working with multiple
infrastructure vendors, such as Huawei Technologies and Nokia Siemens
Networks, to perform interoperability tests for dual-carrier HSPA+ and LTE.
Among the many device manufacturers currently evaluating the new chipsets are
Huawei, LG Electronics, Novatel Wireless, Sierra Wireless and ZTE.

"HSPA's faster data speeds and added capacity offers an attractive upgrade
path for our growing network," said Eric Gan, representative director,
president and COO at Japan EMOBILE Ltd. "We see Qualcomm's new dual-carrier
HSPA+ and LTE technology as a real potential benefit for our customers."

"Telstra is on track to start deploying the next evolution of Dual-carrier
HSPA+ technology in the Next G(TM) network by the end of 2009," said Mike
Wright, executive director at Telstra Wireless. "Following our successful
collaboration in developing the world's first HSPA+ commercial network and
device, we are working with Qualcomm and looking forward to their MDM8220
chipsets to support the evolution of our network."

"Huawei is committed to providing its customers with the latest infrastructure
and mobile devices," said Wan Biao, president of Wireless Product Line at
Huawei Technologies. "We are pleased to be helping bring these new
technologies to market with our infrastructure products, as well as with
products that enable consumers to experience the benefits of dual-carrier
HSPA+ and LTE."

"As a leader in LTE infrastructure deployment with a focus on driving a
healthy ecosystem for LTE, we appreciate the versatility of Qualcomm's
multi-mode 3G/LTE and dual-carrier HSPA+ products," said Tommi Uitto, head of
Wireless Access product management at Nokia Siemens Networks. "Flexible
solutions that offer a seamless migration path to next-generation network
technologies are critical for our industry to move fast and encourage a quick
uptake of new services."

"It is very inspiring to begin working with these latest network solutions to
help us offer additional benefits to our consumers," said In-kyung Kim, vice
president of the LG Electronics Mobile Handset R&D Center 4G Development Team.
"With LG's advanced mobile devices set to adopt these promising chipsets,
consumers will benefit from a more seamless communications experience and
access to enhanced services. LG stands at the forefront of embracing this
next-generation technology, which promises to usher in a new era of mobile
communications."

"We look forward to evaluating all of these next-generation network solutions
from Qualcomm," said Rob Hadley, chief marketing officer at Novatel Wireless,
Inc. "Our goal is to deliver a broad range of high-quality HSPA+ and LTE
wireless modems and modules to wireless network operators, and these new
chipsets from Qualcomm appear to offer significant advantages in integration,
power savings and performance features."

"The shift to HSPA and EV-DO is already driving growing demand for mobile
broadband devices," said Jim Kirkpatrick, chief technology officer at Sierra
Wireless, Inc. "Qualcomm's new dual-carrier HSPA+ and LTE chipsets should
help that growth momentum to continue well into the next decade."

"We see LTE and dual-carrier HSPA+ as an important opportunity for us to
increase our market penetration in developed markets," said Kan Yulun, vice
president of Handset R&D Division at ZTE Corp. "Qualcomm's chipsets offer us
a way to quickly bring LTE and dual-carrier HSPA+ devices to market."

Qualcomm's MDM8220 dual-carrier HSPA+ solution, based on the 3GPP Release 8
standard, provides peak downlink data rates of up to 42 megabits per second
(Mbps) and 11 Mbps on the uplink, allowing carriers to easily upgrade their
existing infrastructure equipment to achieve significantly higher bandwidths.
Its dual-carrier technology doubles networks' bandwidth from 5 MHz to 10 MHz
by aggregating two HSPA carriers in parallel.

The MDM9200 and the MDM9600 chipsets are the industry's first multi-mode
3G/LTE solutions that allow UMTS and CDMA2000® operators to upgrade seamlessly
to future LTE services while preserving backward compatibility to their
existing 3G networks. MDM9200 supports UMTS, HSPA+ and LTE, while the MDM9600
supports CDMA2000® 1X, EV-DO Rev. B, SV-DO, SV-LTE, UMTS, HSPA+ and LTE. All
of the new chipsets support FDD LTE and TDD LTE modes and different carrier
bandwidths, and are capable of using orthogonal frequency division multiple
access (OFDMA) and multiple-input and multiple-output (MIMO) antenna
technology to support peak data rates of up to 100 Mbps on the downlink and 50
Mbps on the uplink.

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering
innovative digital wireless communications products and services based on CDMA
and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm
is included in the S&P 100 Index, the S&P 500 Index and is a 2009 FORTUNE 500®
company. For more information, please visit www.qualcomm.com.

Except for the historical information contained herein, this news release
contains forward-looking statements that are subject to risks and
uncertainties, including the Company's ability to successfully design and have
manufactured significant quantities of the MDM8220, MDM9200 and MDM9600
solutions on a timely and profitable basis, the extent to which dual-carrier
HSPA+ and multi-mode 3G/LTE network technologies are adopted and deployed, the
speed with which dual-carrier HSPA+ and multi-mode 3G/LTE network technologies
are adopted and deployed, the time when data-centric devices based on the
MDM8220, MDM9200 and the MDM9600 solutions are commercially available, change
in economic conditions of the various markets the Company serves, as well as
the other risks detailed from time to time in the Company's SEC reports,
including the report on Form 10-K for the year ended September 27, 2009.

Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile Data
Modem, MDM, MDM8220, MDM9200 and MDM9600 are trademarks of Qualcomm
Incorporated. CDMA2000 is a registered trademark of the Telecommunications
Industry Association (TIA USA). All other trademarks are the property of
their respective owners.

Qualcomm Contacts:
Kira Lee Golin, Qualcomm CDMA Technologies
Phone: 1-858-651-1554
Email: qctpublicrelations@qualcomm.com

Tina Asmar, Corporate Communications
Phone: 1-858-845-5959
Email: corpcomm@qualcomm.com

John Gilbert, Investor Relations
Phone: 1-858-658-4813
Email: ir@qualcomm.com

SOURCE Qualcomm Incorporated

Kira Lee Golin, Qualcomm CDMA Technologies, +1-858-651-1554,
qctpublicrelations@qualcomm.com, or Tina Asmar, Corporate Communications,
+1-858-845-5959, corpcomm@qualcomm.com, or John Gilbert, Investor Relations,
+1-858-658-4813, ir@qualcomm.com