New Issue-Temasek Financial issues S$300mln bond

SINGAPORE | Tue Nov 24, 2009 5:46am EST

SINGAPORE Nov 24 (Reuters) - Following are terms and conditions of a bond to be issued on December 07, 2009

Borrower Temasek Financial Limited

Form of debt Fixed Rate Bond,MTN

Issue Amount S$300 million

Coupon 4% pa semi-annual

Issue Date December 07, 2009

Maturity Date December 07, 2029

Coupon Payment Date 07 June and 07 December

Commencing on 07 June 2010

Denominations S$250,000

Lead Manager DBS Bank Ltd

For ratings information, double click on RRS0001

For all bonds data, double click on BONDS

For Top international bonds news [TOP/EUB]

For news about this issuer, double click on the issuer RIC,

where assigned, and hit F9 on Reuters terminals.

Data supplied by International Insider. ((Suman Honnavar, suman.honnavar@thomsonreuters.com; Reuters Messaging: suman.honnavar.reuters.com@reuters.net; Tel: +91 80 4135 5464))

Cyclical Consumer Goods
Financials
Comments (0)
This discussion is now closed. We welcome comments on our articles for a limited period after their publication.