3M Releases Material Library for Use in ANSYS Simulation Software

3M Embedded Capacitance Material now available in HFSS and SIwave
LAS VEGAS--(Business Wire)--
Printed circuit board (PCB) and integrated circuit (IC) package design engineers
can now download a simulated model of Embedded Capacitance Materials (ECM) from
3M for use in HFSS™ and SIwave™ engineering simulation software. Part of the
Ansoft family of products from ANSYS, Inc. (NASDAQ: ANSS), HFSS and SIwave
technologies enable design engineers to perform complete signal- and
power-integrity analyses from DC to beyond 10 Gbps on PCBs and IC packages. The
availability of 3M ECM in the HFSS and SIwave programs means that design
engineers can better address their noise issues early in the design cycle by
incorporating the material into their design simulations, resulting in improved
performance with fewer design spins.

3M ECM is a thin, high-performance embedded capacitor laminate that helps reduce
impedance, power bus noise, EMI and discrete capacitor count. The material
allows design engineers to differentiate their products through dramatically
improved performance and reduced size because the laminate uses less board "real
estate" than surface mounted decoupling capacitors. 3M ECM is compatible with
most rigid and flex PCB processing, including laser drilling. Fabricators and
OEMs worldwide may use 3M ECM without purchasing a license from 3M. The material
is RoHS Compliant 2005/95/EC*.

"3M`s embedded capacitance material library will give HFSS and SIwave simulation
software users a real competitive advantage," said Larry Williams, director of
product management at ANSYS. "State-of-the-art product design must incorporate
advanced technology materials and tools. Providing easy access to these
next-generation 3M materials means that designers can concentrate on improving
the signal and power integrity of their products in development rather than at
the prototype stage."

The 3M ECM library can be downloaded for use within ANSYS products at
http://www.ansoft.com/products/hf/hfss/3MEmbeddedCapacitanceMaterial.cfm.

HFSS technology is the industry-standard software for 3-D full-wave
electromagnetic field simulation for design, simulation, and validation of
complex RF, microwave, high-speed channel and power-delivery systems in modern,
high-performance electronics. SIwave software is an electromagnetic field solver
that performs broadband signal- and power-integrity analyses along with DC
voltage and current analysis for complete boards and packages with HFSS
technology. SIwave offers comprehensive electromagnetic interference and
compatibility analyses, and it has the unique ability to couple board and
package electromagnetic fields for complete system-level simulation.

"Because HFSS is industry-standard simulation software for design engineers, it
just made sense for 3M to participate in the Ansoft tools design library," said
Vishal Pahwa, global lead for Embedded Capacitance Material, 3M Electronic
Solutions Division. "3M`s Embedded Capacitance Material gives design engineers
an excellent tool to improve electrical performance and ultimately create better
products."

*RoHS Compliant 2005/95/EC means that the product or part ("Product") does not
contain any of the substances in excess of the maximum concentration values in
EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/EC, unless
the substance is in an application that is exempt under EU RoHS. Unless
otherwise stated by 3M in writing, this information represents 3M`s best
knowledge and belief based upon information provided by third party suppliers to
3M.

About ANSYS, Inc.

ANSYS, Inc., founded in 1970, develops and globally markets engineering
simulation software and technologies widely used by engineers, designers,
researchers and students across a broad spectrum of industries and academia. The
Company focuses on the development of open and flexible solutions that enable
users to analyze designs directly on the desktop, providing a common platform
for fast, efficient and cost-conscious product development, from design concept
to final-stage testing and validation. The Company and its global network of
channel partners provide sales, support and training for customers.
Headquartered in Canonsburg, Pennsylvania, U.S.A., with more than 60 strategic
sales locations throughout the world, ANSYS, Inc. and its subsidiaries employ
over 1,600 people and distribute ANSYS products through a network of channel
partners in over 40 countries. Visit www.ansys.com for more information.

About 3M Electronic Solutions Division

3M Electronics Solutions Division offers innovative solutions to the electronics
market, such as static control products; copper interconnect systems; cables and
cable assemblies; carrier and cover tapes and trays; flexible circuits; embedded
capacitor materials; and Textool brand test and burn-in sockets. For more
information on these solutions available from the 3M Electronic Solutions
Division, visit http://www.3Mcapacitance.com.

More information about 3M Company, available online.

3M and Textool are trademarks of 3M Company. Camera Link is a trademark of
Automated Imaging Association ANSYS, Inc. brand, product, service and feature
names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc.
or its subsidiaries in the United States or other countries.
All other trademarks listed herein are owned by their respective companies.

3M
Jane Kovacs, 512-984-6747
jkovacs@mmm.com
on twitter @3MJane
or
For all other inquiries:
http://www.3m.com/MediaContact

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