Tensilica Introduces Third Generation ConnX 545CK 8-MAC VLIW DSP Core

SANTA CLARA, CA, Apr 22 (MARKET WIRE) --
Tensilica,(R) Inc. today introduced its third generation ConnX 545CK
8-MAC (multiply-accumulate) VLIW (very long instruction word) DSP
(digital signal processor) core for system-on-chip (SOC) designs.
Improvements in this third generation dataplane processor (DPU) core
deliver up to 20 percent faster clock speed, 11 percent smaller die and
up to 30 percent lower power consumption.

The ConnX 545CK is ideal for SOC dataplane signal processing because it
allows system control and high-speed signal processing throughput in a
single core with a single compiler and single instruction stream. It
combines a base CPU controller with a DSP that can sustain eight
simultaneous MAC operations on independent data pairs per cycle,
utilizing the 160-bit vector registers.

"The seamless blending of traditional CPU and traditional DSP
characteristics makes all of Tensilica's ConnX brand DPUs uniquely well
suited to a variety of wired and wireless communications applications,"
stated Steve Roddy, Tensilica's vice president of marketing and business
development. "The ConnX 545CK is a ready-to-use, off-the-shelf octal- MAC
solution. And for designers seeking to tailor a DSP further, the ConnX
545CK can be augmented to perfectly suit a particular target application
by utilizing the unique customization capabilities of Tensilica's Xtensa
LX3 processor."

The ConnX 545CK features a 3-issue VLIW architecture with eight 16-bit
multipliers that operate in SIMD (single instruction, multiple data)
mode. The core can sustain eight parallel multiply-accumulate operations
per cycle. The compiler automatically vectorizes code to take maximum
advantage of the architecture. It also has two 128-bit load/store units
and a built-in Viterbi convolutional coder accelerator.

One of the unique features of the ConnX 545CK is the 32-bit input/output
Queue interfaces that function like FIFOs (first in, first out), to
bypass the system bus and communicate directly to streaming data
interfaces. This allows much faster data throughput than traditional
DSPs, which require memory-based load and store operations on each data
element.

Availability
The ConnX 545CK Revision C is available now. In 65GP
optimized for high speed, the ConnX 545CK delivers over 600 MHz operation.

About Tensilica
Tensilica, Inc. is the leader in customizable dataplane
processors IP cores. Dataplane Processor Units (DPUs) combine the best
capabilities of CPUs and DSPs while delivering 10-to-100-times the
performance because they can be customized using Tensilica's automated
design tools to meet specific signal processing performance targets.
Tensilica's DPUs power SOC designs at system OEMs and six out of the top
10 semiconductor companies for products including mobile phones, consumer
electronics devices (including digital TV, Blu-ray Disc players,
broadband set top boxes, digital still cameras and portable media
players), computers, and storage, networking and communications
equipment. For more information on Tensilica's patented, benchmark-proven
DPUs visit www.tensilica.com.

Editors' Notes:

-- Tensilica and Xtensa are registered trademarks belonging to Tensilica
Inc. All other company and product names mentioned are trademarks
and/or registered trademarks of their respective owners.
-- Tensilica's announced licensees include: ADDMM, Afa Technologies,
ALPS, Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay
Microsystems, Blue Wonder, Brocade, Broadcom, Cisco Systems, CMC
Microsystems, Conexant Systems, Design Art Networks, DS2, EE
Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Fujitsu
Microelectronics Ltd., the HiSilicon division of Huawei, Hudson Soft,
iBiquity Digital, Ikanos Communications, IDT, Intel, Juniper Networks,
LG Electronics, Lucid Information Technology, Marvell, NEC
Laboratories America, NEC Corporation, Neterion, Nethra Imaging,
Nippon Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical
Co. Ltd., Panasonic Mobile, Penstar, Plato Networks, PnpNetwork
Technologies, PowerLayer Microsystems, Samsung, SiBEAM, Sony,
STMicroelectronics, Stretch, TranSwitch Corporation, Triductor
Technology, UpZide, Valens Semiconductor, Validity Sensors, Victor
Company of Japan (JVC), WiLinx, and XM Radio.

Press Contacts:
Paula Jones
(408) 327-7343
paula@tensilica.com

Erika Powelson
(831) 424-1811
erika@powelsoninc.com

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