Crossing Automation Receives Four Key Patents for Semiconductor Manufacturing Automation

FREMONT, CA, Jun 29 (MARKET WIRE) --
Crossing Automation, Inc. (www.crossinginc.com), a leading supplier of
flexible, cost-effective front-end and back-end automation solutions and
engineering services to semiconductor equipment manufacturers, today
announced it has received four new patents. These patents cover
atmospheric loadports, robotic wafer handling, and wafer handling
end-effectors, further extending Crossing's leadership in wafer-level
automation technology.

"Crossing Automation has a strong history of creative technological
contributions in the areas of semiconductor manufacturing automation,
environmental control, and material identification and tracking," said
Bob MacKnight, president and CEO of Crossing. "The technology covered by
these patents was developed in response to new market requirements and
from fresh insight into improved solutions for existing requirements.
These patents highlight our continuing commitment to bring to market
innovative solutions for wafer-level automation that are cost-effective
and also reduce development cycle time for our OEM customers."

These key patents add new capabilities to Crossing's ExpressConnect(TM)
product line and will be implemented in semiconductor manufacturing
equipment, Crossing's primary market. Moving forward, Crossing is
applying these patents to other applicable manufacturing equipment
including green technologies such as LED and PV, as well as applications
in the life sciences market.

A brief summary of the newly granted patents highlights Crossing's role
as a strategic provider of solutions for the semiconductor and related
industries:

Wafer Engine(TM), patent number 7,648,327

This patent covers Crossing's Wafer Engine(TM); an advanced solution for
both high throughput substrate handling as well as its ability to service
two to six or more loadports. The wafer engine incorporates a field
proven folded Vertical Travel axis, which saves space and weight in
conjunction with a dual-slide linear travel end effector assembly that
facilitates rapid 'dual swap' wafer exchanges. The patent also describes
the capability for a means to provide wafer alignment and environmental
conditioning stations on the end-effector slidebody. The wafer engine is
an important sub-system in Crossing's ExpressConnect family of components
and sub-systems and one of the primary reasons for the success of the
Spartan(TM) EFEM and Wafer Sorter product lines currently used in a
significant number of 300 mm semiconductor wafer fabs.

Variable Lot Size Loadport, patent numbers 7,585,144 and 7,597,523

These patents cover a BOLTs style loadport that is equipped with a
vertically indexable container support assembly as well as a position
controllable environmental shield plate. These capabilities enable
flexible interfacing of a process tool loadport with containers of
varying capacity and/or construction. Alternative front opening unified
pod (FOUP) transport and tool-loading architectures are also facilitated.

Ultra Low Contact Area End-Effector, patent number 7,669,903

This patent describes a means for supporting and handling semiconductor
wafers or other thin substrates in a manner that minimizes particulate
generation and/or particle transfer at the critical interface between the
wafer's backside surface and the end-effector's support/gripping surface.
Additionally, the supports have the ability to adaptively conform to a
non-planar wafer, which may be distorted due to surface stresses or
gravitational sag. The wafer contact elements are also able to be
exchanged/renewed without removal or adjustment of the end-effector
structure.

In countries where Crossing operates, the company currently holds 124
patents and has 44 additional applications on file. Crossing directly
manufactures, sells and services all of its own products and does not
presently license its IP or technology to third party providers.

ABOUT CROSSING AUTOMATION:
Crossing Automation is a leading supplier of
flexible, cost-effective front-end and back-end automation solutions and
engineering services to semiconductor equipment manufacturers. The
company's unique approach to automation solutions enables its customers
to shorten time to market, lower development costs and reduce total
costs. Through its front-end and back-end automation solutions, Crossing
achieves critical manufacturing flexibility for OEMs and IC manufacturers
alike.

Crossing's End-to-End Automation Platforms
Crossing Automation's
ExpressConnect(TM) modular building block family of automation components
delivers integrated atmospheric and vacuum substrate handling sub-systems
with small footprints, low costs and high productivity for semiconductor
manufacturing. Crossing also delivers a broad range of leading-edge,
cost-effective 300 mm, 200 mm, and 150 mm component technologies to both
OEMs and semiconductor manufacturers including isolation, robotics, and
tracking. Crossing implements a system architecture that uses highly
reliable linear transfer devices and simplified control algorithms to
improve efficiencies and control reliability and is key to enabling a
comprehensive, flexible, end-to-end automation solution.

Company Contact:
Larry Dulmage
Crossing Automation
Tel: 510-661-5007
E-Mail: larry.dulmage@crossinginc.com

Agency Contact:
Amy Smith
Impress Public Relations
Tel: 401-369-9266
E-Mail: amy@impress-pr.com

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