Tessera wins round in patent fight with Spansion, others
WASHINGTON Dec 21 (Reuters) - Tessera (TSRA.O) has won a round in a chip patent dispute with Qualcomm (QCOM.O), Spansion (CODE.N), Freescale Semiconductor [FSLSM.UL], ATI Technologies and STMicroelectronics (STM.PA), according to a U.S. appeals court ruling.
The Court of Appeals for the Federal Circuit ruled on Tuesday that the five companies had infringed Tessera patents for methods to package semiconductor chips so they are protected inside portable devices.
The appeals court upheld a ruling by the U.S. International Trade Commission, which hears patent cases involving imported goods.
The ITC had also issued an order to prohibit importation of chips that infringe the Tessera patents and issued a cease and desist order to stop infringement. (Reporting by Diane Bartz; Editing by Lisa Von Ahn)
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