Tekelec to Discuss the Future of LTE Service Delivery and Interoperability at LTE Asia 2011

MORRISVILLE, NC, Sep 01 (MARKET WIRE) --
Tekelec (NASDAQ: TKLC), the mobile broadband solutions company, is a
bronze sponsor and speaker at the 6th annual LTE Asia conference, held in
Suntec City, Singapore from September 6 - 7, 2011 at the International
Convention & Exhibition Centre.

Matt McCann, principal architect, will discuss how to cost effectively
scale and secure Diameter traffic in LTE networks. Mr. McCann will speak
on key Diameter interfaces, and use cases for policy management and
charging, roaming between LTE networks and topology hiding. His session
will be held on September 6 at 2:40 p.m.

At 4:20 p.m., Mr. McCann will join the "Enabling Advanced Services Using
the Diameter Signaling Protocol" panel, which includes Dimitris Mavrakis,
senior analyst at Informa Telecoms & Media. The panel will cover:

-- The importance of Diameter to all-IP networks
-- How to provide cost-effective, intelligent network solutions for
data-dominated networks
-- Scaling the network as subscribers and traffic grow

The next day at 6:30 p.m., Dan Bantukul, principal architect, will
be a panelist for the "What is the Impact of introducing LTE into mature
HSPA, GSM and EDGE Networks?" topic. The panel includes Japanese operator
KDDI and Indonesian operator PT Telkomsel. Discussion topics include:

-- Performance and customer experience risks from deploying multiple
network technologies
-- Opportunities to support technology based coverage zones
-- Effective strategy for introducing new services
-- Assessment to adding LTE deployment to legacy networks
-- Switching legacy networks off during LTE migration

Full LTE Asia 2011 program information can be found at
http://asia.lteconference.com/.

Mr. McCann brings more than 20 years of telecommunications experience,
including 13 years at Tekelec in product management and marketing. Prior
to Tekelec, McCann worked for AT&T Bell Laboratories in various systems
engineering and system test roles for both switching and intelligent
network systems.

Mr. Bantukul has more than 20 years of industry experience in hardware
engineering, embedded system programming, product management and product
marketing. He has extensive knowledge of Diameter, SIP, and SS7 and has
been awarded numerous patents.

Supporting Resources
The Rise of Diameter Signaling white paper

Diameter Signaling Router application handbook
Frost & Sullivan's New
Product Innovation Award, Diameter Routing
The Path to LTE white paper

About Tekelec
Tekelec connects people and devices to the mobile
Internet. Our portfolio's unique layer of network intelligence allows
service providers to both manage and monetize the exponential growth in
mobile web, video and applications traffic. Tekelec has more than 25
offices around the world serving customers in more than 100 countries.
For more information visit www.tekelec.com.

Contact:
Adam Parken
Senior Manager, Marketing Communications
(o) +1.919.653.9681
adam.parken@tekelec.com

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