Deca Technologies Announces Company Launch

TEMPE, AZ, Nov 09 (MARKET WIRE) --
Charting a new course for the future of electronic systems, Deca
Technologies has launched a breakthrough approach to creating advanced
electronic interconnect solutions. Leveraging the unique, cost-effective
solar wafer manufacturing methods of SunPower Corp. (NASDAQ: SPWRA)
(NASDAQ: SPWRB) and financial, operational and manufacturing support from
Cypress Semiconductor Corp. (NASDAQ: CY), Deca's proprietary solutions
uniquely position it to reshape the way the world designs and
manufactures electronic devices.

Deca's initial products include a series of WLCSP (Wafer Level Chip Scale
Packaging) derivatives targeted at the current $1 billion-plus WLP (Wafer
Level Packaging) market. Growth in WLPs continues to be driven primarily
by the desire of handset OEMs to integrate more features and
functionality into less space. Miniaturization, cost and performance
benefits increasingly lead to a preference for WLP solutions. However, as
traditional strip-based package technologies give way to advanced
wafer-based methods, significant capital strain and cycle time challenges
have burdened the supply chain.

Deca's investors include Cypress and SunPower. The new company is part of
Cypress's Emerging Technology Division. Cypress drives entrepreneurship
and innovation by funding autonomous businesses in much the same way
venture capital companies fund startups. This approach has delivered
multiple successes for Cypress and its shareholders, including SunPower,
which was spun out of Cypress in 2008 in a $2.6-billion tax-free
shareholder distribution.

"We saw an incredible opportunity to apply SunPower's solar wafer
processing technology and methods to slash through the capital and cycle
time constraints that have held back rapid acceptance of advanced
interconnect solutions," commented Tim Olson, Deca president and CEO.
"Our unique approach enables breakthrough new product capabilities,
improved cycle time and unrivaled flexibility, all at the price point the
industry requires for mass adoption."

"SunPower continues to set the world's standard for high-efficiency
silicon solar cells with our proprietary advanced wafer processing
methods, which originally grew out of semiconductor manufacturing
processes," noted Tom Werner, SunPower president & CEO. "When Tim
approached us with the idea to adapt our technology 'back' into
semiconductors, and to address an industrywide challenge, we signed on as
knowledge property providers and investors in Deca Technologies."

In a board presentation on the future of silicon interconnect, Cypress
President and CEO T.J. Rodgers said:

"As Moore's Law has progressed over the course of my career from
dimensions of 10 microns (or 10,000 nanometers) to 28 nanometers -- a
factor of 357 linearly and 127,000 in area -- integrated circuits have
progressed by a factor of 10 million, from simple chips with just 100
transistors to billion-transistor chips, such as Cypress's new
144-megabit SRAM. Moore's Law has also improved the speed of Cypress's
memories 15-fold, from 25 ns in 1983 to 1.6 ns today. And during that
same period, power per function has actually come down. Today, our
revolutionary PSoC 3 chip -- which contains a computer, its associated
program and data memories, 24 programmable digital blocks, 20 fixed
digital functions and 20 high-performance analog blocks -- uses only 3.6
mW of power, four times less than the power of the sunlight that strikes
an area the size of the chip.

"Despite this breathtaking progress, there is an economic problem
preventing the full integration promised by Moore's Law: advanced
semiconductor chips are becoming so specialized that they can't be
integrated into one chip. For example, due to process incompatibilities,
there are no microprocessors available today with integrated DRAM. The
process for one type of chip, for example, a 0.35-micron RF chip, may
cost $0.02 per square millimeter -- making it horribly uneconomical to
integrate an RF block onto a microprocessor wafer costing $0.10 per
square millimeter. Today's systems contain very different chips made in
different processes, in different fabs, and even in different countries.
They therefore cannot be integrated on silicon and must be connected on
PC boards, an ancient technology with 500-micron dimensions and a host of
reliability problems.

"We want to use the dense, reliable silicon interconnect inherent in
Moore's Law to integrate the dissimilar chips used in today's systems,
but we face an economic barrier because the interconnect on silicon chips
is 1,000 times more expensive than the interconnect on PC boards.

"We could enable a new silicon-based interconnect paradigm if we could
make silicon interconnect wafers for $10, just what silicon solar wafers
cost today. The problem of mapping solar technology onto Moore's Law is
straightforward, but difficult, and we believe DecaTech has the answer."

With respect to Deca's initial product offering, E. Jan Vardaman,
president and founder of TechSearch International, stated that WLPs will
maintain double-digit unit growth with a CAGR of 12.5 percent and annual
volumes exceeding 20 billion units by 2014.

"We are uniquely positioned to take advantage of this expanding market,"
Olson said. "We have met stringent reliability requirements and are now
fully qualified for production with first revenue expected in early 2012.
Given the high level of customer interest and engineering activity, we
anticipate multiple additional customer qualifications in the next few
quarters. With typical handset OEM PCN (Product Change Notice) acceptance
windows averaging around one additional quarter, we are planning for our
production ramp in late 2012."

About Deca Technologies Inc

Deca Technologies is an advanced electronic interconnect solutions
provider that initially provides wafer level chip scale packaging (WLCSP)
services to the semiconductor industry. Deca's unique integration of
solar and semiconductor technologies provides our customers with
unrivaled new product introduction, rapid cycle time and powerful
flexibility, all with the best value in the industry. Deca Technologies
is a majority owned and fully independent subsidiary of Cypress. For more
information, please visit www.decatechnologies.com.

CONTACTS

Company Contact
Garry Pycroft
VP Sales and Marketing
Deca Technologies
Tel + 1 480 345 9895
garry.pycroft@decatechnologies.com

Media Enquiries
Mark Button
Partner & Director PR Labs
Impress Labs
Tel + 1 503 616 3817
mark@impresslabs.com

Company Contact
Joe McCarthy
Director Corporate Communications
Cypress Semiconductor Corp.
Tel + 1 408 943 2902
jmy@cypress.com

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