Rudolph Technologies to Hold Dec. 9 Technology Forum in Tokyo

Rudolph Technologies to Hold Dec. 9 Technology Forum in Tokyo

The full-day session will focus on TSV applications

Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today it will hold a Yield Forum^™ Seminar in Tokyo on December 9, 2011. The Rudolph Yield Forum is a technology and applications seminar for semiconductor manufacturing professionals—fab managers, tool owners and process engineers. The agenda includes presentation of current application data and results from the company’s ongoing tool evaluations and process control systems at semiconductor fabs around the world.

Time: 10:00am – 5:00pm

Place: Room 103, International Conference Hall 1F (near Semicon Japan Makuhari Messe)

Register by email yieldforum@rudolphtech.co.jp, or call Rudolph Japan +81 (44) 829 5511.

Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The company’s yield management solutions are used in both the wafer processing and final manufacturing of ICs, as well as in emerging markets such as LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at www.rudolphtech.com.

Rudolph Technologies, Inc.
Virginia Becker, 952-259-1647
virginia.becker@rudolphtech.com