UMC Achieves Foundry's First 55nm SDDI Customer Product Tape-out<2303.TW>

Tue Dec 18, 2012 5:00am EST

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World's first 55nm display driver IC process enables Full-HD smartphone

HSINCHU,  Taiwan, Dec. 18, 2012 /PRNewswire/ -- United Microelectronics
Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor
foundry, today announced that it has taped out the foundry industry's first
customer product utilizing 55nm small display driver IC (SDDI) process
technology. UMC, the world's leading SDDI foundry in both process technology and
shipping volume, is now the first foundry to offer a 55nm version of the process
to enable Full-HD resolutions for today's smartphones.   

Yau Kae Sheu, senior director of UMC's 12-inch Specialty Technology Development
division, said, "This world-leading 55nm SDDI process nicely complements our
comprehensive display driver technology portfolio. With our volume production
0.13um and our recently introduced new generation 80nm SDDI technologies,
customers now have the flexibility to design into a full range of smartphone
resolutions depending on their application, including WVGA, qHD, HD720/WXGA, and
now Full-HD, fully covering smartphone display requirements from 3.5-inch to
larger than 5-inch."

The 55nm SDDI process features an ultra small SRAM size (0.4um2) and provides an
ideal balance of power consumption, performance, and chip size for integration
into high-end Full-HD smartphones that demand low power and a slim profile. 55nm
SDDI customer products will be manufactured using advanced 300mm wafer
technology, with fast manufacturing cycle to fit customer time-to-market needs.
The 55nm process leverages UMC's world-leading position in SDDI, with over 300
million SDDI chips shipped for today's mainstream smartphones.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that
provides advanced technology and manufacturing for applications spanning every
major sector of the IC industry. UMC's customer-driven foundry solutions allow
chip designers to leverage the company's leading-edge processes, which include
28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS,
and a wide range of specialty technologies. Production is supported through 10
wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in 
Taiwan  and  Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are
in production for customer products down to 28nm. Construction is underway for
Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000
people worldwide and has offices in  Taiwan,  Japan,  Singapore,  Europe, and 
the United States. UMC can be found on the web at

Note From UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking within
the meaning of the U.S. Federal Securities laws, including statements about
future outsourcing, wafer capacity, technologies, business relationships and
market conditions. Investors are cautioned that actual events and results could
differ materially from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and economy; acceptance
and demand for products from UMC; and technological and development risks.
Further information concerning these risks is included in UMC's filings with the
U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.

Editorial Contacts:

Richard Yu
+886-2-2658-9168 ext. 16951

SOURCE  United Microelectronics Corporation
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