Aehr Test Systems Schedules Second Quarter Fiscal Year 2013 Earnings Release and Conference Call

Thu Dec 20, 2012 8:00am EST

* Reuters is not responsible for the content in this press release.

FREMONT, Calif., Dec. 20, 2012 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today announced that it will report
financial results for the second quarter of fiscal 2013 ended November 30, 2012 after the market
closes on Wednesday, January 9, 2013.

Management of Aehr Test Systems will host a conference call and webcast that same day at 5:00 p.m.
Eastern (2:00 p.m. Pacific) to discuss the Company's operating performance. The conference call
will be accessible live via the internet at

. Please go to the website at least 15 minutes before start time to register, download and install
any necessary audio software. A replay of the webcast will be available at

for 90 days.

About Aehr Test Systems                        

Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems
for burning-in and testing logic and memory integrated circuits and has an installed base of more
than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test requirements, capacity needs and
opportunities for Aehr Test products in package and wafer level test. Aehr Test has developed and
introduced several innovative products, including the ABTS and FOX family of test and burn-in
systems and the DiePak carrier. The ABTS system is used in production and qualification testing of
packaged parts for both low-power and high-power logic as well as all common types of memory
devices. The FOX system is a full wafer contact test and burn-in system used for burn-in and
functional test of complex devices, such as leading-edge memories, digital signal processors,
microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable,
temporary package that enables IC manufacturers to perform cost-effective final test and burn-in
of bare die. For more information, please visit the Company's website at

CONTACT: Gary Larson
         Chief Financial Officer
         (510) 623-9400 x321
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