UMC Introduces Thick Plated Copper Process for Monolithic PMIC Applications<2303.TW>
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For best results when printing this announcement, please click on the link below: http://pdf.reuters.com/pdfnews/pdfnews.asp?i=43059c3bf0e37541&u=urn:newsml:reuters.com:20130115:nPnHK42575 Integrated TPC service provides customers with a package level solution to increase PMIC chip efficiency HSINCHU, Taiwan, Jan. 15, 2013 /PRNewswire/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today introduced a Thick Plated Copper (TPC) process for power management IC (PMIC) applications. The TPC solution, developed with Taiwan-based packaging house Chipbond Technology Corp. (6147, TWO), provides thick plated copper layers to achieve higher current flow and better thermal dissipation, reducing chip resistance by 20% or more compared with conventional Aluminum top metal, thus increasing power conversion efficiency and extending battery life. Furthermore, since the integrated converter requires fewer and smaller passive components for the power system, the resulting smaller size printed circuit boards makes the application ideal for slim profile mobile power management products such as smartphones, tablets, and ultrabooks. "Today's ever-evolving portable digital applications place greater demands for slimmer products while maintaining longer battery life," said Anchor Chen, senior director of the Specialty Technology Development division at UMC. "Working with Chipbond, we are pleased to offer UMC customers an integrated service for a TPC process to address these requirements at chip-level to enhance end-product performance while reducing size. We look forward to the rapid adoption of this solution as we roll-out our TPC process for a variety of UMC technologies." The TPC solution is now ready for UMC 8" BCD (Bipolar/CMOS/DMOS) processes including 0.35um, 0.25um, and 0.18um nodes, with 0.11um available in the coming months. Validated design rules will be provided to customers by UMC and Chipbond, with qualification reports available upon request. About UMC UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com. Note From UMC Concerning Forward-Looking Statements Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information concerning these risks is included in UMC's filings with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended. Editorial Contacts: UMC Richard Yu (886) 2-2658-9168 ext. 16951 email@example.com SOURCE United Microelectronics Corporation
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