UMC Introduces Thick Plated Copper Process for Monolithic PMIC Applications<2303.TW>

Tue Jan 15, 2013 5:00am EST

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Integrated TPC service provides customers with a package level solution to
increase PMIC chip efficiency
HSINCHU,  Taiwan,  Jan. 15, 2013  /PRNewswire/ -- United Microelectronics
Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor
foundry, today introduced a Thick Plated Copper (TPC) process for power
management IC (PMIC) applications. The TPC solution, developed with 
Taiwan-based packaging house Chipbond Technology Corp. (6147, TWO), provides
thick plated copper layers to achieve higher current flow and better thermal
dissipation, reducing chip resistance by 20% or more compared with conventional
Aluminum top metal, thus increasing power conversion efficiency and extending
battery life. Furthermore, since the integrated converter requires fewer and
smaller passive components for the power system, the resulting smaller size
printed circuit boards makes the application ideal for slim profile mobile power
management products such as smartphones, tablets, and ultrabooks.

"Today's ever-evolving portable digital applications place greater demands for
slimmer products while maintaining longer battery life," said Anchor Chen,
senior director of the Specialty Technology Development division at UMC.
"Working with Chipbond, we are pleased to offer UMC customers an integrated
service for a TPC process to address these requirements at chip-level to enhance
end-product performance while reducing size. We look forward to the rapid
adoption of this solution as we roll-out our TPC process for a variety of UMC

The TPC solution is now ready for UMC 8" BCD (Bipolar/CMOS/DMOS) processes
including 0.35um, 0.25um, and 0.18um nodes, with 0.11um available in the coming
months. Validated design rules will be provided to customers by UMC and
Chipbond, with qualification reports available upon request.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that
provides advanced technology and manufacturing for applications spanning every
major sector of the IC industry. UMC's customer-driven foundry solutions allow
chip designers to leverage the company's leading-edge processes, which include
28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS,
and a wide range of specialty technologies. Production is supported through 10
wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in 
Taiwan  and  Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are
in production for customer products down to 28nm. Construction is underway for
Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000
people worldwide and has offices in  Taiwan,  Japan,  Singapore,  Europe, and 
the United States. UMC can be found on the web at

Note From UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking within
the meaning of the U.S. Federal Securities laws, including statements about
future outsourcing, wafer capacity, technologies, business relationships and
market conditions. Investors are cautioned that actual events and results could
differ materially from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and economy; acceptance
and demand for products from UMC; and technological and development risks.
Further information concerning these risks is included in UMC's filings with the
U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.

Editorial Contacts:

Richard Yu                      
(886) 2-2658-9168 ext. 16951              

SOURCE  United Microelectronics Corporation

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